Inventor · disambiguated record
Hirotaka Okonogi
Also filed as: OKONOGI HIROTAKA
29 granted patents·596 citations·filing 1987–2006
97Inventor score
Top patents by PatentIndex Score
29 records- 0192US7238087B1Planarizing device and a planarization method for semiconductor substratesOKAMOTO MACHINE TOOL WORKS·Filed 2006·Granted Jul 3, 2007·35 cites·12 claims
- 0288US5133120AMethod of filling conductive material into through holes of printed wiring boardNIPPON CMK KK·Filed 1991·Granted Jul 28, 1992·69 cites·17 claims
- 0387US5268194AMethod of packing filler into through-holes in a printed circuit boardNIPPON CMK KK·Filed 1991·Granted Dec 7, 1993·63 cites·13 claims
- 0475US5145691AApparatus for packing filler into through-holes or the like in a printed circuit boardNIPPON CMK KK·Filed 1991·Granted Sep 8, 1992·39 cites·11 claims
- 0574US5191709AMethod of forming through-holes in printed wiring boardNIPPON CMK KK·Filed 1991·Granted Mar 9, 1993·37 cites·4 claims
- 0672US5220135APrinted wiring board having shielding layerNIPPON CMK KK·Filed 1990·Granted Jun 15, 1993·33 cites·11 claims
- 0771US5210940AMethod of producing a printed circuit boardNIPPON CMK KK·Filed 1991·Granted May 18, 1993·34 cites·9 claims
- 0866US5028743APrinted circuit board with filled throughholesNIPPON CMK KK·Filed 1990·Granted Jul 2, 1991·23 cites·10 claims
- 0965US5266748APrinted wiring board having through-holes covered with ink layer and method of manufacture thereofNIPPON CMK KK·Filed 1991·Granted Nov 30, 1993·34 cites·10 claims
- 1065US4991060APrinted circuit board having conductors interconnected by foamed electroconductive pasteNIPPON CMK KK·Filed 1989·Granted Feb 5, 1991·22 cites·4 claims
- 1162US5030800APrinted wiring board with an electronic wave shielding layerNIPPON CMK KK·Filed 1990·Granted Jul 9, 1991·20 cites·8 claims
- 1261US5100695AMethod of manufacturing a printed circuit boardNIPPON CMK KK·Filed 1989·Granted Mar 31, 1992·19 cites·11 claims
- 1359US5294755APrinted wiring board having shielding layerNIPPON CMK KK·Filed 1991·Granted Mar 15, 1994·20 cites·16 claims
- 1457US5262596APrinted wiring board shielded from electromagnetic waveNIPPON CMK KK·Filed 1991·Granted Nov 16, 1993·19 cites·10 claims
- 1557US4806706APrinted wiring boardNIPPON CMK KK·Filed 1987·Granted Feb 21, 1989·18 cites·16 claims
- 1651US5112648AMethod of manufacturing a printed circuit boardNIPPON CMK KK·Filed 1991·Granted May 12, 1992·15 cites·3 claims
- 1749US5196230AMethod for connecting an electromagnetic wave shielding layer with a ground circuit in a printed circuit boardNIPPON CMK KK·Filed 1991·Granted Mar 23, 1993·13 cites·8 claims
- 1848US5236736AMethod for manufacturing an electromagnetic wave shield printed wiring boardNIPPON CMK KK·Filed 1991·Granted Aug 17, 1993·13 cites·12 claims
- 1945US5210379APrinted wiring board with electromagnetic wave shielding layerNIPPON CMK KK·Filed 1992·Granted May 11, 1993·11 cites·11 claims
- 2045US4859805APrinted wiring boardNIPPON CMK KK·Filed 1988·Granted Aug 22, 1989·11 cites·19 claims
- 2144US5308644AMethod for manufacturing a printed wiring board having a shield layerNIPPON CMK KK·Filed 1991·Granted May 3, 1994·10 cites·1 claims
- 2243US4885431APrinted circuit boardNIPPON CMK KK·Filed 1988·Granted Dec 5, 1989·10 cites·6 claims
- 2340US5219607AMethod of manufacturing printed circuit boardNIPPON CMK KK·Filed 1991·Granted Jun 15, 1993·8 cites·11 claims
- 2439US4900602APrinted wiring boardNIPPON CMK KK·Filed 1988·Granted Feb 13, 1990·6 cites·8 claims
- 2536US4929491APrinted wiring boardNIPPON CMK KK·Filed 1988·Granted May 29, 1990·5 cites·12 claims
- 2634US5234745AMethod of forming an insulating layer on a printed circuit boardNIPPON CMK KK·Filed 1990·Granted Aug 10, 1993·4 cites·6 claims
- 2731US5268535APrinted wiring boardNIPPON CMK KK·Filed 1991·Granted Dec 7, 1993·2 cites·16 claims
- 2831US5195238AMethod of manufacturing a printed circuit boardNIPPON CMK KK·Filed 1992·Granted Mar 23, 1993·3 cites·5 claims
- 2930US5240737AMethod of manufacturing printed circuit boardsNIPPON CMK KK·Filed 1991·Granted Aug 31, 1993·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →