Inventor · disambiguated record
Hisashi Okuchi
Also filed as: OKUCHI HISASHI
40 granted patents·23 pending applications·235 citations·filing 1999–2024
97Inventor score
Top patents by PatentIndex Score
63 records- 0195US7838425B2Method of treating surface of semiconductor substrateTOSHIBA KK·Filed 2008·Granted Nov 23, 2010·27 cites·9 claims
- 0295US7749909B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2009·Granted Jul 6, 2010·46 cites·24 claims
- 0392US7985683B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2010·Granted Jul 26, 2011·13 cites·30 claims
- 0492US7635397B2Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor deviceTOSHIBA KK·Filed 2008·Granted Dec 22, 2009·16 cites·8 claims
- 0588US9673217B1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Jun 6, 2017·6 cites·6 claims
- 0683US6492271B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Dec 10, 2002·27 cites·25 claims
- 0782US9991111B2Apparatus and method of treating surface of semiconductor substrateTOSHIBA MEMORY CORP·Filed 2017·Granted Jun 5, 2018·2 cites·19 claims
- 0881US9859111B2Apparatus and method of treating surface of semiconductor substrateTOSHIBA MEMORY CORP·Filed 2015·Granted Jan 2, 2018·2 cites·18 claims
- 0981US8372212B2Supercritical drying method and apparatus for semiconductor substratesTOSHIBA KK·Filed 2012·Granted Feb 12, 2013·5 cites·5 claims
- 1081US8097538B2Method of manufacturing semiconductor deviceKOIDE TATSUHIKO·Filed 2010·Granted Jan 17, 2012·7 cites·20 claims
- 1179US8771429B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusJI LINAN·Filed 2012·Granted Jul 8, 2014·5 cites·8 claims
- 1277US8435903B2Semiconductor substrate surface treatment methodOGAWA YOSHIHIRO·Filed 2011·Granted May 7, 2013·4 cites·20 claims
- 1376US9384980B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Granted Jul 5, 2016·3 cites·10 claims
- 1476US8950082B2Supercritical drying method for semiconductor substrateSATO YOHEI·Filed 2012·Granted Feb 10, 2015·3 cites·13 claims
- 1576US6286524B1Wafer drying apparatus and method with residual particle removability enhancementTOSHIBA KK·Filed 1999·Granted Sep 11, 2001·46 cites·6 claims
- 1675US2024318344A1Anodization apparatusKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1773US11342182B2Substrate treatment device, substrate treatment method, and semiconductor device manufacturing methodKIOXIA CORP·Filed 2019·Granted May 24, 2022·1 cites·11 claims
- 1873US9583330B2Supercritical drying method for semiconductor substrate and supercritical drying apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Feb 28, 2017·2 cites·4 claims
- 1973US9126229B2Deposit removal methodTAHARA SHIGERU·Filed 2012·Granted Sep 8, 2015·3 cites·8 claims
- 2072US7776756B1Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 17, 2010·3 cites·7 claims
- 2167US9570286B2Supercritical drying method for semiconductor substrateTOSHIBA KK·Filed 2015·Granted Feb 14, 2017·1 cites·17 claims
- 2266US9065064B2Manufacturing method and manufacturing apparatus of functional elementTOSHIBA KK·Filed 2013·Granted Jun 23, 2015·1 cites·15 claims
- 2365US9991159B2Semiconductor device manufacture methodTOSHIBA MEMORY CORP·Filed 2017·Granted Jun 5, 2018·1 cites·8 claims
- 2463US10096462B2Substrate processing method and storage mediumTOSHIBA KK·Filed 2013·Granted Oct 9, 2018·1 cites·7 claims
- 2562US10199240B2Substrate processing method, substrate processing apparatus, and storage mediumHAYASHI HIDEKAZU·Filed 2012·Granted Feb 5, 2019·1 cites·7 claims
- 2662US9177781B2Plasma processing method and manufacturing method of semiconductor deviceTAHARA SHIGERU·Filed 2011·Granted Nov 3, 2015·1 cites·8 claims
- 2759US10522596B2Semiconductor storage device comprising resistance change film and method of manufacturing the sameTOSHIBA MEMORY CORP·Filed 2018·Granted Dec 31, 2019·1 cites·12 claims
- 2858US2022280969A1Substrate treatment apparatus and substrate treatment methodKIOXIA CORP·Filed 2021·Application pending·0 cites
- 2956US10529588B2Substrate treatment method and substrate treatment apparatusTOSHIBA MEMORY CORP·Filed 2018·Granted Jan 7, 2020·0 cites·7 claims
- 3056US7097784B2Etching method and apparatus for semiconductor wafersTOSHIBA KK·Filed 2003·Granted Aug 29, 2006·4 cites·7 claims
- 3156US2009317980A1Filter, substrate treatment apparatus and substrate treatment methodTOSHIBA KK·Filed 2009·Application pending·0 cites
- 3253US7267742B2Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Sep 11, 2007·3 cites·8 claims
- 3352US10014186B2Substrate treatment method and substrate treatment apparatusTOSHIBA MEMORY CORP·Filed 2016·Granted Jul 3, 2018·0 cites·9 claims
- 3452US2014174482A1Supercritical drying method for semiconductor substrateTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3551US12022668B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3651US8375964B2Template cleaning method, system, and apparatusTOSHIBA KK·Filed 2009·Granted Feb 19, 2013·0 cites·20 claims
- 3751US8148175B2Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor deviceOKUCHI HISASHI·Filed 2009·Granted Apr 3, 2012·0 cites·12 claims
- 3850US2006255014A1Etching method and apparatus for semiconductor wafersTOSHIBA KK·Filed 2006·Application pending·0 cites
- 3949US10573508B2Surface treatment apparatus and method for semiconductor substrateTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 25, 2020·0 cites·20 claims
- 4048US2010044343A1Substrate treatment apparatus and substrate treatment methodTOMITA HIROSHI·Filed 2009·Application pending·0 cites
- 4147US8865563B2Film embedding method and semiconductor deviceTOSHIBA KK·Filed 2013·Granted Oct 21, 2014·0 cites·20 claims
- 4247US2011143541A1Apparatus and method of treating surface of semiconductor substrateOGAWA YOSHIHIRO·Filed 2010·Application pending·0 cites
- 4347US2005211378A1Filter, substrate treatment apparatus and substrate treatment methodIIMORI HIROYASU·Filed 2005·Application pending·0 cites
- 4445US8709170B2Supercritical drying method for semiconductor substrateSATO YOHEI·Filed 2011·Granted Apr 29, 2014·0 cites·6 claims
- 4545US8695145B2Cleaning method, cleaning apparatusYOSHIMIZU YASUHITO·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
- 4644US8772164B2Method for forming interconnection pattern and semiconductor deviceYOSHIMIZU YASUHITO·Filed 2012·Granted Jul 8, 2014·0 cites·17 claims
- 4744US2015206773A1Substrate processing method and apparatus thereforTOSHIBA KK·Filed 2014·Application pending·0 cites
- 4843US8741168B2Wet etching method for silicon nitride filmYOSHIMIZU YASUHITO·Filed 2012·Granted Jun 3, 2014·0 cites·18 claims
- 4943US2014065555A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 5043US2022077183A1Semiconductor device and method of manufacturing sameKIOXIA CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →