Inventor · disambiguated record
Hideyuki Osada
Also filed as: OSADA HIDEYUKI
4 granted patents·4 pending applications·553 citations·filing 2012–2023
71Inventor score
Top patents by PatentIndex Score
8 records- 0191USD691974SHolding pad for transferring a waferOSADA HIDEYUKI·Filed 2012·Granted Oct 22, 2013·553 cites·1 claims
- 0257US2024181654A1Pad and end effectorTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0353US2023245871A1Substrate processing system and particle removal methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0453US2024178044A1Transfer system, processing system, and transfer methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0552US2023395421A1Mounting pad, mounting mechanism, and substrate transfer mechanismTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0650US12062557B2Substrate processing system and particle removal methodTOKYO ELECTRON LTD·Filed 2021·Granted Aug 13, 2024·0 cites·24 claims
- 0748US12285786B2Substrate processing apparatus, purge gas control method, and vacuum transfer chamber cleaning methodTOKYO ELECTRON LTD·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 0823USD693319SHolding pad for transferring a waferOSADA HIDEYUKI·Filed 2012·Granted Nov 12, 2013·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Hideyuki Osada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →