Inventor · disambiguated record
Hideaki Sakaguchi
Also filed as: SAKAGUCHI HIDEAKI
87 granted patents·23 pending applications·800 citations·filing 1992–2018
99Inventor score
Top patents by PatentIndex Score
110 records- 0197US8536714B2Interposer, its manufacturing method, and semiconductor deviceSAKAGUCHI HIDEAKI·Filed 2012·Granted Sep 17, 2013·56 cites·15 claims
- 0297US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0395US8137497B2Method of manufacturing wiring substrateSUNOHARA MASAHIRO·Filed 2009·Granted Mar 20, 2012·38 cites·14 claims
- 0495US6980416B2Capacitor, circuit board with built-in capacitor and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 27, 2005·34 cites·13 claims
- 0594US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0694US7820479B2Conductive ball mounting methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 26, 2010·28 cites·8 claims
- 0793US7795140B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·28 cites·12 claims
- 0890US7524753B2Semiconductor device having through electrode and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 28, 2009·20 cites·12 claims
- 0990US7507655B2Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 24, 2009·19 cites·5 claims
- 1089US7825423B2Semiconductor device and method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 2, 2010·17 cites·12 claims
- 1188US8080122B2Method of manufacturing wiring substrate and method of manufacturing semiconductor deviceSUNOHARA MASAHIRO·Filed 2009·Granted Dec 20, 2011·12 cites·9 claims
- 1287US7838897B2Light-emitting device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 23, 2010·14 cites·6 claims
- 1384US9052341B2Probe card and manufacturing method thereofSHIRAISHI AKINORI·Filed 2012·Granted Jun 9, 2015·6 cites·10 claims
- 1484US7488094B2Semiconductor device and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 1584US6861284B2Semiconductor device and production method thereofSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 1, 2005·25 cites·4 claims
- 1683US8314344B2Wiring board and manufacturing method of the sameSAKAGUCHI HIDEAKI·Filed 2009·Granted Nov 20, 2012·11 cites·9 claims
- 1783US7981798B2Method of manufacturing substrateSHINKO ELECTRIC IND CO·Filed 2008·Granted Jul 19, 2011·12 cites·5 claims
- 1883US7494898B2Method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 24, 2009·11 cites·6 claims
- 1983US7054141B2Capacitor, capacitor-embedded board, and method for manufacturing the capacitorSHINKO ELECTRIC IND CO·Filed 2005·Granted May 30, 2006·12 cites·13 claims
- 2082US6713863B2Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portionSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 30, 2004·29 cites·2 claims
- 2182US6583383B2Method and apparatus for cutting a semiconductor waferSHINKO ELECTRIC IND CO·Filed 2001·Granted Jun 24, 2003·26 cites·7 claims
- 2280US6404070B1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 11, 2002·31 cites·17 claims
- 2379US8922234B2Probe card and method for manufacturing probe cardSHINKO ELECTRIC IND CO·Filed 2013·Granted Dec 30, 2014·3 cites·4 claims
- 2479US6420787B1Semiconductor device and process of producing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 16, 2002·24 cites·11 claims
- 2577US8669643B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Mar 11, 2014·5 cites·11 claims
- 2676US7854367B2Apparatus and method for arranging magnetic solder ballsSHINKO ELECTRIC IND CO·Filed 2010·Granted Dec 21, 2010·3 cites·1 claims
- 2776US7784671B2Apparatus and method for arranging magnetic solder ballsSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·5 cites·1 claims
- 2876US7703662B2Conductive ball mounting apparatus and conductive ball mounting methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Apr 27, 2010·5 cites·10 claims
- 2976US7597233B2Apparatus and method of mounting conductive ballSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 6, 2009·4 cites·2 claims
- 3075US8309860B2Electronic component built-in substrate and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted Nov 13, 2012·6 cites·5 claims
- 3173US8810007B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Aug 19, 2014·4 cites·12 claims
- 3273US8330050B2Wiring board having heat intercepting memberSAKAGUCHI HIDEAKI·Filed 2009·Granted Dec 11, 2012·6 cites·16 claims
- 3373US7897432B2Method for producing electronic part packageSHINKO ELECTRIC IND CO·Filed 2009·Granted Mar 1, 2011·4 cites·8 claims
- 3473US7834438B2Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 16, 2010·5 cites·8 claims
- 3573US7655956B2Semiconductor device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 2, 2010·5 cites·10 claims
- 3672US8671561B2Substrate manufacturing methodIIDA KIYOAKI·Filed 2008·Granted Mar 18, 2014·7 cites·10 claims
- 3772US7788061B2Substrate and mask aligning apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 31, 2010·3 cites·12 claims
- 3872US6766266B1Testing device and testing method for semiconductor integrated circuitsSHARP KK·Filed 2000·Granted Jul 20, 2004·15 cites·11 claims
- 3971US7854366B2Method of mounting conductive ball and conductive ball mounting apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Dec 21, 2010·4 cites·6 claims
- 4071US6850085B2Reference voltage generating device, semiconductor integrated circuit including the same, and testing device and method for semiconductor integrated circuitSHARP KK·Filed 2003·Granted Feb 1, 2005·11 cites·14 claims
- 4171US6535011B1Testing device and testing method for a semiconductor integrated circuit and storage medium having the testing program stored thereinSHARP KK·Filed 2000·Granted Mar 18, 2003·14 cites·23 claims
- 4270US8053886B2Semiconductor package and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2009·Granted Nov 8, 2011·4 cites·16 claims
- 4369US7169195B2Capacitor, circuit board with built-in capacitor and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 30, 2007·5 cites·11 claims
- 4468US9646924B2Interposer, method for manufacturing interposer, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted May 9, 2017·2 cites·12 claims
- 4568US8299628B2Conductive ball mounting apparatus having a movable conductive ball containerSAKAGUCHI HIDEAKI·Filed 2010·Granted Oct 30, 2012·2 cites·15 claims
- 4668US7622317B2Light emitting diode and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 24, 2009·3 cites·5 claims
- 4766US6259038B1Semiconductor chip mounting board and method of inspecting the same mounting boardSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 10, 2001·30 cites·22 claims
- 4865US7866533B2Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Jan 11, 2011·3 cites·7 claims
- 4965US7644856B2Solder ball mounting method and solder ball mounting apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Jan 12, 2010·1 cites·9 claims
- 5065US6548326B2Semiconductor device and process of producing sameSHINKO ELECTRONIC IND CO LTD·Filed 2001·Granted Apr 15, 2003·14 cites·18 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →