Inventor · disambiguated record
Hiroyuki Sakaue
Also filed as: SAKAUE HIROYUKI
4 granted patents·2 pending applications·9 citations·filing 2002–2010
66Inventor score
Files withRORZE CORP2DAIKEN CHEMICAL CO LTD1ELPIDA MEMORY INC1SAKURAI TOSHIO1SEMICONDUCTOR TECH ACAD RES CT1
Top patents by PatentIndex Score
6 records- 0154US7749920B2Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the sameRORZE CORP·Filed 2004·Granted Jul 6, 2010·5 cites·9 claims
- 0250US2009283013A1Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic componentsRORZE CORP·Filed 2009·Application pending·0 cites
- 0349US6852624B2Electroless plating process, and embedded wire and forming process thereofSEMICONDUCTOR TECH ACAD RES CT·Filed 2002·Granted Feb 8, 2005·4 cites·19 claims
- 0443US8158536B2Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the sameSAKURAI TOSHIO·Filed 2010·Granted Apr 17, 2012·0 cites·10 claims
- 0540US7371694B2Semiconductor device fabrication method and fabrication apparatusELPIDA MEMORY INC·Filed 2005·Granted May 13, 2008·0 cites·18 claims
- 0639US2007107317A1Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic componentsDAIKEN CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →