Inventor · disambiguated record
Hitoshi Sakuma
Also filed as: SAKUMA HITOSHI
43 granted patents·10 pending applications·150 citations·filing 1989–2020
97Inventor score
Top patents by PatentIndex Score
53 records- 0191US9331262B2Thin film piezoelectric element, thin film piezoelectric actuator, thin film piezoelectric sensor, hard drive disk, and inkjet printer deviceTDK CORP·Filed 2013·Granted May 3, 2016·7 cites·9 claims
- 0291US8981627B2Piezoelectric device with electrode films and electroconductive oxide filmSAKUMA HITOSHI·Filed 2012·Granted Mar 17, 2015·21 cites·18 claims
- 0388US7261307B2Suspension armTOYOTA JIDOSHA KABUSHIKIKAISYA·Filed 2006·Granted Aug 28, 2007·29 cites·6 claims
- 0486US10377418B2Suspension member for vehicleTOYOTA MOTOR CO LTD·Filed 2017·Granted Aug 13, 2019·6 cites·1 claims
- 0580US8994251B2Piezoelectric device having first and second non-metal electroconductive intermediate filmsKURACHI KATSUYUKI·Filed 2012·Granted Mar 31, 2015·5 cites·4 claims
- 0677US9136820B2Piezoelectric deviceAIDA YASUHIRO·Filed 2012·Granted Sep 15, 2015·6 cites·14 claims
- 0771US9685602B2Piezoelectric thin film element, piezoelectric actuator, piezoelectric sensor, hard-disk drive and ink jet printer deviceTDK CORP·Filed 2016·Granted Jun 20, 2017·2 cites·14 claims
- 0871US7582908B2Nitride semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Sep 1, 2009·3 cites·17 claims
- 0969US7785697B2Thin film deviceTDK CORP·Filed 2007·Granted Aug 31, 2010·5 cites·5 claims
- 1066US7964424B2Method for manufacturing nitride semiconductor light-emitting elementMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Jun 21, 2011·2 cites·19 claims
- 1163US7879635B2Method for manufacturing semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Feb 1, 2011·2 cites·11 claims
- 1261US11456576B2Method for manufacturing optical semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Sep 27, 2022·0 cites·5 claims
- 1361US8163576B2Nitride semiconductor device having a silicon-containing layer and manufacturing method thereofSHIOZAWA KATSUOMI·Filed 2009·Granted Apr 24, 2012·2 cites·10 claims
- 1459US11466349B2Spheroidal graphite cast ironHIJII TAKUMI·Filed 2018·Granted Oct 11, 2022·0 cites·7 claims
- 1559US9065049B2Thin film piezoelectric deviceTDK CORP·Filed 2012·Granted Jun 23, 2015·1 cites·6 claims
- 1658US5080208AShift lever apparatus for automatic transmission of vehicleTOKAI RIKA CO LTD·Filed 1989·Granted Jan 14, 1992·16 cites·18 claims
- 1755US9147826B2Thin film piezoelectric element, thin film piezoelectric actuator, and thin film piezoelectric sensor; and hard disk drive, and inkjet printerTDK CORP·Filed 2014·Granted Sep 29, 2015·0 cites·8 claims
- 1854US11791610B2Semiconductor laser device manufacturing method and semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 17, 2023·0 cites·11 claims
- 1953US10964879B2Method of manufacturing a dielectric deviceTDK CORP·Filed 2017·Granted Mar 30, 2021·0 cites·19 claims
- 2053US8186696B2Steering tie rod end made of steel and method of manufacturing the sameKOMOTO TAKESHI·Filed 2009·Granted May 29, 2012·4 cites·9 claims
- 2153US7795738B2Nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Sep 14, 2010·0 cites·16 claims
- 2253US6812197B2Iron-based cleaning powderKOBE STEEL LTD·Filed 2003·Granted Nov 2, 2004·1 cites·5 claims
- 2352US7683398B2Nitride semiconductor device having a silicon-containing connection layer and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Mar 23, 2010·0 cites·3 claims
- 2451US11594668B2Thin film laminate, thin film device and multilayer substrateTDK CORP·Filed 2019·Granted Feb 28, 2023·0 cites·12 claims
- 2550US11616342B2Semiconductor optical element, semiconductor optical integrated element, and method for manufacturing semiconductor optical elementMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 28, 2023·0 cites·14 claims
- 2650US2010190282A1Method for manufacturing multiple-wavelength semiconductor laserMITSUBISHI ELECTRIC CORP·Filed 2009·Application pending·0 cites
- 2749US7897418B2Method for manufacturing semiconductor light emitting deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Mar 1, 2011·0 cites·20 claims
- 2849US5610957AReactor core coolant flow rate control system for a BWR type nuclear power plantHITACHI LTD·Filed 1995·Granted Mar 11, 1997·11 cites·28 claims
- 2949US2014084754A1Thin film piezoelectric deviceTDK CORP·Filed 2012·Application pending·0 cites
- 3048US9076968B2Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer deviceTDK CORP·Filed 2013·Granted Jul 7, 2015·0 cites·9 claims
- 3148US7791097B2Nitride semiconductor device and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Sep 7, 2010·0 cites·10 claims
- 3248US5286275APowder mixture for powder metallurgy and binder thereforKOBE STEEL LTD·Filed 1992·Granted Feb 15, 1994·13 cites·7 claims
- 3347US9277869B2Thin-film piezoelectric element, thin-film piezoelectric actuator, thin-film piezoelectric sensor, hard disk drive, and inkjet printer apparatusTDK CORP·Filed 2013·Granted Mar 8, 2016·0 cites·11 claims
- 3446US9837596B2Piezoelectric device, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer apparatusTDK CORP·Filed 2014·Granted Dec 5, 2017·0 cites·7 claims
- 3546US9147827B2Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer deviceTDK CORP·Filed 2012·Granted Sep 29, 2015·0 cites·9 claims
- 3646US9130169B2Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and inkjet printer deviceTDK CORP·Filed 2013·Granted Sep 8, 2015·0 cites·7 claims
- 3746US7714439B2Nitride semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2007·Granted May 11, 2010·0 cites·6 claims
- 3846US2009184336A1Semiconductor light emitting device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 3946US2009127661A1Nitride semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 4044US10790434B2Piezoelectric thin film-stacked body, piezoelectric thin film substrate, piezoelectric thin film device, piezoelectric actuator, piezoelectric sensor, head assembly, head stack assembly, hard disk drive, printer head, and ink-jet printer deviceTDK CORP·Filed 2017·Granted Sep 29, 2020·0 cites·12 claims
- 4144US8482096B2Semiconductor photodetector and manufacturing method thereforKIKUCHI MATOBU·Filed 2008·Granted Jul 9, 2013·0 cites·13 claims
- 4243US9022532B1Piezoelectric element, piezoelectric actuator, piezoelectric sensor, hard disk drive, and ink-jet printer deviceTDK CORP·Filed 2013·Granted May 5, 2015·0 cites·5 claims
- 4341US10116121B2Semiconductor device manufacturing method and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 30, 2018·0 cites·9 claims
- 4441US2013320813A1Dielectric deviceKURACHI KATSUYUKI·Filed 2012·Application pending·0 cites
- 4540US2005109982A1Agent and method for removing organic chlorine compoundsKOBE STEEL LTD·Filed 2004·Application pending·0 cites
- 4638US10744832B2Control armNIPPON STEEL & SUMITOMO METAL CORP·Filed 2016·Granted Aug 18, 2020·0 cites·12 claims
- 4737US2017201064A1Method of manufacturing semiconductor laser elementMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 4837US2011193126A1Semiconductor light-emitting element and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2010·Application pending·0 cites
- 4936US2011013655A1Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2010·Application pending·0 cites
- 5036US2010244074A1Semiconductor light-emitting device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2010·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →