Inventor · disambiguated record
Hideyuki Sando
Also filed as: SANDO HIDEYUKI
3 granted patents·47 citations·filing 2001–2003
69Inventor score
Files withDISCO CORP3
Top patents by PatentIndex Score
3 records- 0180US6676491B2Semiconductor wafer dividing methodDISCO CORP·Filed 2002·Granted Jan 13, 2004·30 cites·5 claims
- 0270US6500047B2Semiconductor wafer cutting machineDISCO CORP·Filed 2001·Granted Dec 31, 2002·16 cites·4 claims
- 0342US7278206B2Method of preparing terminal boardDISCO CORP·Filed 2003·Granted Oct 9, 2007·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →