Inventor · disambiguated record
Hiroaki Sekikawa
Also filed as: SEKIKAWA HIROAKI
9 granted patents·2 pending applications·68 citations·filing 1998–2019
85Inventor score
Top patents by PatentIndex Score
11 records- 0182US6025620ASemiconductor device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 15, 2000·47 cites·11 claims
- 0279US9679858B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·4 cites·18 claims
- 0375US10546802B2Semiconductor device including a substrate contact plug and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 28, 2020·4 cites·12 claims
- 0465US9947708B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 17, 2018·2 cites·20 claims
- 0563US9553121B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 24, 2017·1 cites·14 claims
- 0661US10141363B2Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·1 cites·10 claims
- 0753US8106437B2Semiconductor storage deviceSATO HIDENORI·Filed 2005·Granted Jan 31, 2012·2 cites·9 claims
- 0842US11329152B2Semiconductor device and method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted May 10, 2022·0 cites·8 claims
- 0942US2017243840A1Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 1036US2019198453A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1134US6259147B1Semiconductor device having a fuse layerMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →