Inventor · disambiguated record
Hisao Shigihara
Also filed as: SHIGIHARA HISAO
8 granted patents·4 pending applications·28 citations·filing 2005–2017
83Inventor score
Top patents by PatentIndex Score
12 records- 0189US8987861B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 24, 2015·8 cites·20 claims
- 0284US9219108B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 22, 2015·4 cites·10 claims
- 0379US8435868B2Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit deviceSHIGIHARA HISAO·Filed 2009·Granted May 7, 2013·11 cites·9 claims
- 0477US9818815B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 14, 2017·2 cites·15 claims
- 0563US8592984B2Semiconductor integrated circuit device and method of manufacturing the sameSHIGIHARA HIROMI·Filed 2011·Granted Nov 26, 2013·2 cites·4 claims
- 0662US9343395B2Semiconductor device and manufacturing method of sameRENESAS ELECTRONICS CORP·Filed 2013·Granted May 17, 2016·1 cites·2 claims
- 0757US10157974B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·12 claims
- 0850US2009315179A1Semiconductor device having solder bumps protruding beyond insulating filmsSHIGIHARA HIROMI·Filed 2009·Application pending·0 cites
- 0949US9704805B2Semiconductor device and manufacturing method of sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 11, 2017·0 cites·10 claims
- 1043US2006131365A1Method of manufacturing a semiconductor deviceSHIGIHARA HIROMI·Filed 2005·Application pending·0 cites
- 1136US2010301459A1Method for manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 1235US2012235278A1Semiconductor integrated circuit device, method of manufacturing the same, and electronic system using the sameSHIGIHARA HISAO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →