Inventor · disambiguated record
Hisashi Shimizu
Also filed as: SHIMIZU HISASHI
55 granted patents·9 pending applications·1,219 citations·filing 1979–2023
99Inventor score
Top patents by PatentIndex Score
64 records- 0196US6489637B1Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted Dec 3, 2002·146 cites·15 claims
- 0294US4332012AControl system for automotive vehicle component assembly linesNISSAN MOTOR·Filed 1979·Granted May 25, 1982·76 cites·41 claims
- 0393US6730933B1Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted May 4, 2004·85 cites·20 claims
- 0492US4877822AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1988·Granted Oct 31, 1989·42 cites·6 claims
- 0592US4678688AMethod for forming a surface film of cured organosilicon polymer on a substrate surfaceSHINETSU CHEMICAL CO·Filed 1986·Granted Jul 7, 1987·71 cites·3 claims
- 0689US5290882AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 1, 1994·51 cites·10 claims
- 0788US6548832B1Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 15, 2003·53 cites·18 claims
- 0887USD553725SOutdoor-unit of air-conditionerDAIKIN IND LTD·Filed 2007·Granted Oct 23, 2007·36 cites·1 claims
- 0984US6259157B1Hybrid integrated circuit device, and method of manufacturing thereofSANYO ELECTRIC CO·Filed 1998·Granted Jul 10, 2001·58 cites·16 claims
- 1082USD489801SAir purifierDAIKIN IND LTD·Filed 2003·Granted May 11, 2004·26 cites·1 claims
- 1179US7563854B2Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereofSHINETSU CHEMICAL CO·Filed 2006·Granted Jul 21, 2009·3 cites·9 claims
- 1279US5298548AEpoxy resin composition and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 29, 1994·33 cites·15 claims
- 1378US8013056B2White heat-curable silicone resin composition, optoelectronic part case, and molding methodSHINETSU CHEMICAL CO·Filed 2008·Granted Sep 6, 2011·8 cites·7 claims
- 1478USD498296SAir purifierDAIKIN IND LTD·Filed 2003·Granted Nov 9, 2004·22 cites·1 claims
- 1577US5182351AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1990·Granted Jan 26, 1993·20 cites·18 claims
- 1676USD532889SOut door unit for air conditionerDAIKIN IND LTD·Filed 2006·Granted Nov 28, 2006·22 cites·1 claims
- 1776US6330162B2IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereofSANYO ELECTRIC CO·Filed 1998·Granted Dec 11, 2001·48 cites·10 claims
- 1874US6470188B1Method for handoverNIPPON TELEGRAPH & TELEPHONE·Filed 1997·Granted Oct 22, 2002·52 cites·12 claims
- 1972US7550204B2Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor elementSHINETSU CHEMICAL CO·Filed 2006·Granted Jun 23, 2009·5 cites·15 claims
- 2071US11795396B2Dry etching gas composition comprising sulfur-containing fluorocarbon compound having unsaturated bond and dry etching method using the sameKANTO DENKA KOGYO KK·Filed 2022·Granted Oct 24, 2023·0 cites·18 claims
- 2171US6591104B2Method for handoverNIPPON TELEGRAPH & TELEPHONE·Filed 2002·Granted Jul 8, 2003·11 cites·2 claims
- 2270USD532503SOut door unit for air conditionerDAIKIN IND LTD·Filed 2006·Granted Nov 21, 2006·17 cites·1 claims
- 2367USD550822SAir conditionerDAIKIN IND LTD·Filed 2006·Granted Sep 11, 2007·15 cites·1 claims
- 2467US4985751AResin-encapsulated semiconductor devicesSHINETSU CHEMICAL CO·Filed 1989·Granted Jan 15, 1991·32 cites·12 claims
- 2566US12261050B2Method of manufacturing semiconductor device, and etching gasKIOXIA CORP·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
- 2666US11795397B2Dry etching gas composition comprising sulfur-containing fluorocarbon compound and dry etching method using the sameKANTO DENKA KOGYO KK·Filed 2022·Granted Oct 24, 2023·0 cites·13 claims
- 2766US5285107AHybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 1990·Granted Feb 8, 1994·45 cites·17 claims
- 2866US5053445AEpoxy resin compositionSHINETSU CHEMICAL CO·Filed 1989·Granted Oct 1, 1991·12 cites·8 claims
- 2962US11814561B2Dry etching gas composition comprising sulfur-containing fluorocarbon compound having unsaturated bond and dry etching method using the sameKANTO DENKA KOGYO KK·Filed 2019·Granted Nov 14, 2023·0 cites·10 claims
- 3062US5321299AHybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 1992·Granted Jun 14, 1994·32 cites·10 claims
- 3162US4701482AEpoxy resin composition for encapsulation of semiconductor devicesSHINETSU CHEMICAL CO·Filed 1986·Granted Oct 20, 1987·28 cites·1 claims
- 3261US6210811B1Epoxy resin composition, laminate film using the same, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Apr 3, 2001·25 cites·8 claims
- 3360US4389432AMethod of improving adhesion and adhesion improvers used thereforSHINETSU CHEMICAL CO·Filed 1982·Granted Jun 21, 1983·16 cites·8 claims
- 3459US5173544AEpoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1990·Granted Dec 22, 1992·12 cites·10 claims
- 3558US2006229408A1Curable resin composition for sealing LED elementSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 3656US2023080587A1Joining device and method for manufacturing joined objectORIGIN CO LTD·Filed 2021·Application pending·0 cites
- 3756US2021193475A1Method of manufacturing semiconductor device, and etching gasKIOXIA CORP·Filed 2021·Application pending·0 cites
- 3856US2021388264A1Dry etching gas composition comprising sulfur-containing fluorocarbon compound and dry etching method using the sameKANTO DENKA KOGYO KK·Filed 2019·Application pending·0 cites
- 3955US5300588AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1992·Granted Apr 5, 1994·15 cites·8 claims
- 4053US6084037AEpoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1997·Granted Jul 4, 2000·14 cites·2 claims
- 4152US2008008867A1Resin composition for sealing optical device and cured product thereofSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 4251US6235865B1Phosphonium borate compound, making method, curing catalyst, and epoxy resin compositionSHINETSU CHEMICAL CO·Filed 1999·Granted May 22, 2001·14 cites·13 claims
- 4349US2006270786A1Resin composition for sealing optical device and cured product thereofSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 4448US5159433AHybrid integrated circuit device having a particular casing structureSANYO ELECTRIC CO·Filed 1990·Granted Oct 27, 1992·21 cites·31 claims
- 4547US2022078950A1Honeycomb structure and method for manufacturing honeycomb structureMITSUBISHI HEAVY IND LTD·Filed 2021·Application pending·0 cites
- 4646US9726916B2Member bonding apparatusORIGIN ELECTRIC·Filed 2014·Granted Aug 8, 2017·0 cites·3 claims
- 4746US5340851AThermosetting resin compositionsSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 23, 1994·15 cites·27 claims
- 4845US4331820ACis-6-undecene-1-chloride and a method for the preparation thereofSHINETSU CHEMICAL CO·Filed 1981·Granted May 25, 1982·2 cites·4 claims
- 4944US12089388B2Composite material structureMITSUBISHI HEAVY IND LTD·Filed 2022·Granted Sep 10, 2024·0 cites·4 claims
- 5043US11437244B2Dry etching gas composition and dry etching methodKANTO DENKA KOGYO KK·Filed 2018·Granted Sep 6, 2022·0 cites·20 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hisashi Shimizu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →