Inventor · disambiguated record
Hisakazu Takano
Also filed as: TAKANO HISAKAZU
5 granted patents·14 citations·filing 1997–2014
72Inventor score
Files withSHINETSU HANDOTAI KK5
Top patents by PatentIndex Score
5 records- 0163US7810383B2Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Granted Oct 12, 2010·2 cites·20 claims
- 0257US9662805B2Method of resuming operation of wire sawSHINETSU HANDOTAI KK·Filed 2013·Granted May 30, 2017·1 cites·8 claims
- 0340US5800251AApparatus and method of lapping worksSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 1, 1998·9 cites·7 claims
- 0438US10350788B2Method for slicing workpiece and workpiece holderSHINETSU HANDOTAI KK·Filed 2014·Granted Jul 16, 2019·0 cites·14 claims
- 0524US5931147AMethod of cutting a workpiece with a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 3, 1999·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →