Inventor · disambiguated record
Hidekuni Takao
Also filed as: TAKAO HIDEKUNI
11 granted patents·2 pending applications·85 citations·filing 1997–2021
88Inventor score
Top patents by PatentIndex Score
13 records- 0191US9857391B2Plant water dynamics sensorUNIV KAGAWA NAT UNIV CORP·Filed 2015·Granted Jan 2, 2018·6 cites·9 claims
- 0288US10190927B2Tactile sensor and method for evaluating touch feelingUNIV KAGAWA NAT UNIV CORP·Filed 2015·Granted Jan 29, 2019·6 cites·11 claims
- 0384US7956593B2Power generation circuit using electromagnetic waveSEIKO INSTR INC·Filed 2005·Granted Jun 7, 2011·21 cites·9 claims
- 0480US11039576B2Vascular sap measurement sensor and method of manufacturing vascular sap measurement sensorUNIV KAGAWA NAT UNIV CORP·Filed 2017·Granted Jun 22, 2021·3 cites·34 claims
- 0580US7855429B2Electronic circuit device having silicon substrateSEIKO INSTR INC·Filed 2008·Granted Dec 21, 2010·15 cites·14 claims
- 0677US11815411B2Tactile sensor to quantify hairy skin sensationUNIV KAGAWA NAT UNIV CORP·Filed 2019·Granted Nov 14, 2023·2 cites·7 claims
- 0769US6683358B1Silicon integrated accelerometerASAHI CHEMICAL IND·Filed 1997·Granted Jan 27, 2004·30 cites·9 claims
- 0864US8513927B2Power generation circuit for generating and storing electric power utilizing radio wave energyISHIDA MAKOTO·Filed 2011·Granted Aug 20, 2013·2 cites·11 claims
- 0956US12392674B2Tactile sensorUNIV KAGAWA NAT UNIV CORP·Filed 2021·Granted Aug 19, 2025·0 cites·5 claims
- 1055US12426981B2Grip tool, grip system, slip detection device, slip detection program, and slip detection methodUNIV KAGAWA NAT UNIV CORP·Filed 2020·Granted Sep 30, 2025·0 cites·21 claims
- 1145US2005233518A1Electronic circuit device having silicon substrateISHIDA MAKOTO·Filed 2005·Application pending·0 cites
- 1243US10935563B2Vascular sap flow speed sensor and method of manufacturing vascular sap flow speed sensorUNIV KAGAWA NAT UNIV CORP·Filed 2018·Granted Mar 2, 2021·0 cites·18 claims
- 1334US2014088890A1Method for temperature compensation in sensor, computation program for method for temperature compensation, computation processing device, and sensorHAO XIUCHUN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →