Inventor · disambiguated record
Hiroaki Taketani
Also filed as: TAKETANI HIROAKI
15 granted patents·4 pending applications·64 citations·filing 2007–2024
91Inventor score
Top patents by PatentIndex Score
19 records- 0196US11706909B2Integrated assemblies comprising memory cells and shielding material between the memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 18, 2023·3 cites·24 claims
- 0290US8829583B2Semiconductor device and method of forming the sameTAKETANI HIROAKI·Filed 2012·Granted Sep 9, 2014·15 cites·20 claims
- 0388US11139302B2Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·5 cites·26 claims
- 0488US8373226B2Semiconductor device including a Trench-Gate Fin-FETELPIDA MEMORY INC·Filed 2010·Granted Feb 12, 2013·12 cites·13 claims
- 0581US10347639B1Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 9, 2019·3 cites·26 claims
- 0681US9305926B2Semiconductor devicePS4 LUXCO SARL·Filed 2015·Granted Apr 5, 2016·3 cites·13 claims
- 0779US11217588B2Integrated assemblies comprising voids between active regions and conductive shield plates, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 4, 2022·2 cites·29 claims
- 0879US10910379B2Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 2, 2021·2 cites·11 claims
- 0978US7936026B2Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2008·Granted May 3, 2011·6 cites·4 claims
- 1077US8987799B2Semiconductor device and method of forming the samePS4 LUXCO SARL·Filed 2014·Granted Mar 24, 2015·3 cites·12 claims
- 1177US7910988B2Semiconductor device and manufacturing method thereforELPIDA MEMORY INC·Filed 2009·Granted Mar 22, 2011·7 cites·11 claims
- 1272US10896909B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 19, 2021·1 cites·14 claims
- 1370US9496383B2Semiconductor device and method of forming the samePS4 LUXCO SARL·Filed 2014·Granted Nov 15, 2016·2 cites·3 claims
- 1466US2025048618A1Microelectronic devices, and related methods, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1549US9041085B2Semiconductor device and method of forming the sameOYU KIYONORI·Filed 2012·Granted May 26, 2015·0 cites·18 claims
- 1646US2008251861A1Semiconductor apparatus and production method of the sameELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1743US2009230464A1Semiconductor device including trench gate transistor and method of forming the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 1840US2007269967A1Manufacturing method of semiconductor deviceELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 1936US8264892B2Semiconductor device and method of controlling the sameTAKETANI HIROAKI·Filed 2010·Granted Sep 11, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →