Inventor · disambiguated record
Hiroki Tamiya
Also filed as: TAMIYA HIROKI
4 granted patents·2 pending applications·4 citations·filing 2006–2020
61Inventor score
Top patents by PatentIndex Score
6 records- 0178US11638349B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·19 claims
- 0273US8344262B2Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring boardPANASONIC CORP·Filed 2006·Granted Jan 1, 2013·3 cites·19 claims
- 0351US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 0447US8846799B2Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring boardFUJISAWA HIROYUKI·Filed 2008·Granted Sep 30, 2014·0 cites·11 claims
- 0540US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 0639US2022259378A1Resin composition, prepreg, method for manufacturing prepreg, laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →