Inventor · disambiguated record
Hiroaki Tomimori
Also filed as: TOMIMORI HIROAKI
20 granted patents·3 pending applications·265 citations·filing 2000–2007
95Inventor score
Top patents by PatentIndex Score
23 records- 0189US6787480B2Manufacturing method of semicondcutor deviceNEC CORP·Filed 2002·Granted Sep 7, 2004·49 cites·3 claims
- 0284US6592677B1Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutionsNEC ELECTRONICS CORP·Filed 2000·Granted Jul 15, 2003·31 cites·13 claims
- 0383US7138362B2Washing liquid composition for semiconductor substrateNEC ELECTRONICS CORP·Filed 2003·Granted Nov 21, 2006·23 cites·12 claims
- 0476US7312186B2Cleaning solution for semiconductor substrateKANTO KAGAKU·Filed 2004·Granted Dec 25, 2007·19 cites·9 claims
- 0574US7560372B2Process for making a semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 14, 2009·5 cites·9 claims
- 0674US7087562B2Post-CMP washing liquid compositionNEC ELECTRONICS CORP·Filed 2003·Granted Aug 8, 2006·16 cites·5 claims
- 0772US6998352B2Cleaning method, method for fabricating semiconductor device and cleaning solutionNEC ELECTRONICS CORP·Filed 2002·Granted Feb 14, 2006·14 cites·24 claims
- 0872US6864187B2Method of washing a semiconductor waferNEC ELECTRONICS CORP·Filed 2002·Granted Mar 8, 2005·14 cites·22 claims
- 0971US6992050B2Stripping agent composition and method of strippingNEC CORP·Filed 2001·Granted Jan 31, 2006·17 cites·10 claims
- 1070US7170172B2Semiconductor device having a roughened surfaceNEC ELECTRONICS CORP·Filed 2002·Granted Jan 30, 2007·14 cites·16 claims
- 1168US6890864B2Semiconductor device fabricating method and treating liquidNEC ELECTRONICS CORP·Filed 2003·Granted May 10, 2005·12 cites·27 claims
- 1266US7186354B2Anticorrosive treating concentrateSUMITOMO CHEMICAL CO·Filed 2001·Granted Mar 6, 2007·10 cites·27 claims
- 1366US6897150B1Semiconductor wafer surface and method of treating a semiconductor wafer surfaceNEC ELECTRONICS CORP·Filed 2000·Granted May 24, 2005·13 cites·37 claims
- 1465US7268087B2Manufacturing method of semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Sep 11, 2007·10 cites·5 claims
- 1564US7592266B2Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Sep 22, 2009·1 cites·8 claims
- 1661US7312160B2Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Dec 25, 2007·6 cites·17 claims
- 1761US6797648B2Cleaning water for cleaning a wafer and method of cleaning a waferNEC ELECTRONICS CORP·Filed 2002·Granted Sep 28, 2004·7 cites·12 claims
- 1851US7786005B2Method for manufacturing semiconductor device to form a via holeNEC ELECTRONICS CORP·Filed 2006·Granted Aug 31, 2010·1 cites·16 claims
- 1950US7718532B2Method of forming a high-k film on a semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted May 18, 2010·0 cites·6 claims
- 2049US7192835B2Method of forming a high-k film on a semiconductor deviceNEC CORP·Filed 2004·Granted Mar 20, 2007·3 cites·6 claims
- 2145US2004116315A1Liquid composition for cleaning hydrophobic substrate and cleaning method therewithNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 2236US2003027418A1Semiconductor device fabricating method and treating liquidNEC CORP·Filed 2002·Application pending·0 cites
- 2335US2003094610A1Wash water or immersion water used during semiconductor manufacturingFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →