Inventor · disambiguated record
Hiroyuki Yano
Also filed as: YANO HIROYUKI
137 granted patents·45 pending applications·3,331 citations·filing 1992–2022
99Inventor score
Top patents by PatentIndex Score
182 records- 0198US8022136B2Vulcanized rubber composition, pneumatic tire and the process of producing the sameSUMITOMO RUBBER IND·Filed 2008·Granted Sep 20, 2011·45 cites·17 claims
- 0297US6375545B1Chemical mechanical method of polishing wafer surfacesTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·131 cites·17 claims
- 0397US5534106AApparatus for processing semiconductor wafersTOSHIBA KK·Filed 1994·Granted Jul 9, 1996·180 cites·23 claims
- 0496US7455901B2Fiber-reinforced composite material, method for manufacturing the same and applications thereofUNIV KYOTO·Filed 2006·Granted Nov 25, 2008·36 cites·16 claims
- 0595US7855314B2Absorber and absorbent articleDAIO SEISHI KK·Filed 2005·Granted Dec 21, 2010·111 cites·3 claims
- 0695US7717150B2Manufacturing facility of absorbent body, absorbent body and absorbent articleDAIO SEISHI KK·Filed 2005·Granted May 18, 2010·122 cites·10 claims
- 0795US6740590B1Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writingTOSHIBA KK·Filed 2000·Granted May 25, 2004·102 cites·22 claims
- 0895US6454819B1Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 24, 2002·108 cites·37 claims
- 0995US5302240AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1993·Granted Apr 12, 1994·200 cites·22 claims
- 1094US7217662B2Method of processing a substrateTOSHIBA KK·Filed 2005·Granted May 15, 2007·26 cites·18 claims
- 1192US6610629B2Process for producing an oxide catalyst for oxidation or ammoxidationASAHI CHEMICAL IND·Filed 2001·Granted Aug 26, 2003·49 cites·13 claims
- 1292US5775980APolishing method and polishing apparatusTOSHIBA KK·Filed 1996·Granted Jul 7, 1998·105 cites·8 claims
- 1391US8969441B2Cationic microfibrillated plant fibre and manufacturing method for sameYANO HIROYUKI·Filed 2011·Granted Mar 3, 2015·8 cites·5 claims
- 1491US7884259B2Absorbent articleDAIO SEISHI KK·Filed 2005·Granted Feb 8, 2011·111 cites·4 claims
- 1591US7332104B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Feb 19, 2008·15 cites·15 claims
- 1691US7108589B2Polishing apparatus and methodTOSHIBA KK·Filed 2005·Granted Sep 19, 2006·14 cites·12 claims
- 1791US5607718APolishing method and polishing apparatusTOSHIBA KK·Filed 1994·Granted Mar 4, 1997·119 cites·29 claims
- 1891US5398459AMethod and apparatus for polishing a workpieceTOSHIBA KK·Filed 1993·Granted Mar 21, 1995·74 cites·15 claims
- 1990US7307344B2Semiconductor device including a discontinuous film and method for manufacturing the sameTOSHIBA KK·Filed 2005·Granted Dec 11, 2007·17 cites·4 claims
- 2090US5483568APad condition and polishing rate monitor using fluorescenceTOSHIBA KK·Filed 1994·Granted Jan 9, 1996·129 cites·23 claims
- 2189US9327426B2Molding material and manufacturing method thereforYANO HIROYUKI·Filed 2011·Granted May 3, 2016·8 cites·6 claims
- 2289US9255041B2Method for producing conjugated diolefin and apparatus for productionYANO HIROYUKI·Filed 2012·Granted Feb 9, 2016·5 cites·8 claims
- 2389US5445996AMethod for planarizing a semiconductor device having a amorphous layerTOSHIBA KK·Filed 1993·Granted Aug 29, 1995·87 cites·1 claims
- 2488US7595362B2Curable resin compositionNIPPON STEEL CHEMICAL CO·Filed 2005·Granted Sep 29, 2009·13 cites·17 claims
- 2588US7166017B2Slurry for CMP, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Jan 23, 2007·23 cites·24 claims
- 2687US8546634B2Method for production of conjugated diolefinMIDORIKAWA HIDEO·Filed 2010·Granted Oct 1, 2013·6 cites·8 claims
- 2787US7042099B2Semiconductor device containing a dummy wireTOSHIBA KK·Filed 2003·Granted May 9, 2006·35 cites·22 claims
- 2887US5597341ASemiconductor planarizing apparatusTOSHIBA KK·Filed 1995·Granted Jan 28, 1997·60 cites·14 claims
- 2987US5445710AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1994·Granted Aug 29, 1995·86 cites·18 claims
- 3085US5721173AMethod of forming a shallow trench isolation structureTOSHIBA KK·Filed 1997·Granted Feb 24, 1998·76 cites·26 claims
- 3184US6611060B1Semiconductor device having a damascene type wiring layerTOSHIBA KK·Filed 2000·Granted Aug 26, 2003·26 cites·10 claims
- 3284US6429134B1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2000·Granted Aug 6, 2002·33 cites·16 claims
- 3383US7842191B2CMP slurry for metallic film, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Nov 30, 2010·7 cites·11 claims
- 3483US7691473B2Fiber-reinforced composite material, method for manufacturing the same, and applications thereofROHM CO LTD·Filed 2008·Granted Apr 6, 2010·4 cites·18 claims
- 3583US7402521B2Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program thereforTOSHIBA KK·Filed 2006·Granted Jul 22, 2008·8 cites·20 claims
- 3683US6924227B2Slurry for chemical mechanical polishing and method of manufacturing semiconductor deviceJSR CORP·Filed 2001·Granted Aug 2, 2005·28 cites·20 claims
- 3783US6858539B2Post-CMP treating liquid and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Feb 22, 2005·24 cites·9 claims
- 3883US6576554B2Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP processTOSHIBA KK·Filed 2001·Granted Jun 10, 2003·25 cites·6 claims
- 3983US6414499B2Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devicesTOSHIBA KK·Filed 2001·Granted Jul 2, 2002·23 cites·17 claims
- 4082US6312321B1Polishing apparatusTOSHIBA KK·Filed 2000·Granted Nov 6, 2001·22 cites·8 claims
- 4181US8974634B2Cellulose nanofibersYANO HIROYUKI·Filed 2010·Granted Mar 10, 2015·4 cites·3 claims
- 4281US8877841B2Molding material containing unsaturated polyester resin and microfibrillated plant fiberYANO HIROYUKI·Filed 2009·Granted Nov 4, 2014·4 cites·8 claims
- 4381US8372764B2Fiber composite material and method for manufacturing the sameROHM CO LTD·Filed 2007·Granted Feb 12, 2013·12 cites·17 claims
- 4481US7435682B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Oct 14, 2008·8 cites·20 claims
- 4581US6306669B1Method of manufacturing semiconductor deviceKABUSHKI KAISHA TOSHIBA·Filed 1999·Granted Oct 23, 2001·47 cites·10 claims
- 4681US5914275APolishing apparatus and method for planarizing layer on a semiconductor waferTOSHIBA KK·Filed 1997·Granted Jun 22, 1999·43 cites·24 claims
- 4781US5707487AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jan 13, 1998·73 cites·20 claims
- 4880US7883394B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodEBARA CORP·Filed 2008·Granted Feb 8, 2011·5 cites·10 claims
- 4980US6935928B2Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing methodTOSHIBA KK·Filed 2004·Granted Aug 30, 2005·24 cites·20 claims
- 5080US6924236B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 2, 2005·23 cites·26 claims
Showing the top 50 of 182 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →