Inventor · disambiguated record
Hideaki Yoshimi
Also filed as: YOSHIMI HIDEAKI
8 granted patents·1 pending application·6 citations·filing 2007–2021
76Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC4SAITO KIYOSHI2SANYO ELECTRIC CO1SEMICONDUCTOR COMPONENTS IND1YOSHIMI HIDEAKI1
Top patents by PatentIndex Score
9 records- 0165US8736047B2Semiconductor device and manufacturing method thereofYOSHIMI HIDEAKI·Filed 2007·Granted May 27, 2014·5 cites·11 claims
- 0264US12040295B2Semiconductor device with backmetal and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 0361US8809076B2Semiconductor device and method of automatically inspecting an appearance of the sameSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Aug 19, 2014·1 cites·19 claims
- 0452US11114402B2Semiconductor device with backmetal and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Sep 7, 2021·0 cites·13 claims
- 0549US9917010B2Semiconductor device manufacturing methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Mar 13, 2018·0 cites·9 claims
- 0649US7998794B2Resin molded semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2009·Granted Aug 16, 2011·0 cites·2 claims
- 0748US11728424B2Isolation in a semiconductor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 15, 2023·0 cites·16 claims
- 0845US2014027894A1Resin molded semiconductor device and manufacturing method thereofSAITO KIYOSHI·Filed 2013·Application pending·0 cites
- 0944US8648452B2Resin molded semiconductor device and manufacturing method thereofSAITO KIYOSHI·Filed 2011·Granted Feb 11, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →