Inventor · disambiguated record
Houfei Chen
Also filed as: CHEN HOUFEI
15 granted patents·2 pending applications·101 citations·filing 2002–2021
92Inventor score
Top patents by PatentIndex Score
17 records- 0189US8516695B2Method for forming a circuit board via structure for high speed signalingZHAO SHIYOU·Filed 2011·Granted Aug 27, 2013·11 cites·11 claims
- 0289US7676919B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 16, 2010·13 cites·8 claims
- 0386US7992297B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2010·Granted Aug 9, 2011·5 cites·8 claims
- 0481US7149666B2Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structuresUNIV WASHINGTON·Filed 2002·Granted Dec 12, 2006·46 cites·34 claims
- 0577US7778039B2Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noiseMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 17, 2010·9 cites·39 claims
- 0677US7633773B2On-die anti-resonance structure for integrated circuitMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 15, 2009·6 cites·19 claims
- 0776US7459638B2Absorbing boundary for a multi-layer circuit board structureMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·7 cites·18 claims
- 0867US8743555B2Methods for suppressing power plane noiseMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 3, 2014·1 cites·20 claims
- 0960US9055702B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 9, 2015·0 cites·13 claims
- 1060US8243479B2On-die anti-resonance structure for integrated circuitCHEN HOUFEI·Filed 2011·Granted Aug 14, 2012·1 cites·20 claims
- 1160US8023293B2On-die anti-resonance structure for integrated circuitMICRON TECHNOLOGY INC·Filed 2009·Granted Sep 20, 2011·1 cites·20 claims
- 1258US12416964B2Methods and apparatus for bi-directional control of computing unit frequencyINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·22 claims
- 1355US9622358B2Method for forming a circuit board via structure for high speed signalingMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 11, 2017·0 cites·10 claims
- 1452US8508950B2Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noiseCHEN HOUFEI·Filed 2010·Granted Aug 13, 2013·1 cites·28 claims
- 1546US7660708B2S-matrix technique for circuit simulationMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 9, 2010·0 cites·19 claims
- 1646US2006237227A1Circuit board via structure for high speed signalingZHAO SHIYOU·Filed 2005·Application pending·0 cites
- 1744US2007193775A1Impedance matching via structure for high-speed printed circuit boards and method of determining sameMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →