Inventor · disambiguated record
Howard L. Heck
Also filed as: HECK HOWARD · HECK HOWARD L · HECK HOWARD LINCOLN
47 granted patents·13 pending applications·374 citations·filing 1991–2025
98Inventor score
Top patents by PatentIndex Score
60 records- 0191US5384690AFlex laminate package for a parallel processorIBM·Filed 1993·Granted Jan 24, 1995·61 cites·11 claims
- 0289US10386941B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2015·Granted Aug 20, 2019·5 cites·17 claims
- 0389US5620782AMethod of fabricating a flex laminate packageIBM·Filed 1995·Granted Apr 15, 1997·59 cites·1 claims
- 0488US9559905B2Type-C retimer state machine and a protocol for inband control and configurationINTEL CORP·Filed 2014·Granted Jan 31, 2017·10 cites·22 claims
- 0588US7271680B2Method, apparatus, and system for parallel plate mode radial pattern signalingINTEL CORP·Filed 2005·Granted Sep 18, 2007·22 cites·18 claims
- 0687US10996773B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2019·Granted May 4, 2021·3 cites·24 claims
- 0787US2025341570A1Skew detection and compensation for high speed i/o linksSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2025·Application pending·0 cites
- 0885US5301118AMonte carlo simulation design methodologyIBM·Filed 1991·Granted Apr 5, 1994·110 cites·2 claims
- 0983US9106217B2Width scalable connector for high bandwidth IO interfacesJAUSSI JAMES E·Filed 2011·Granted Aug 11, 2015·7 cites·26 claims
- 1081US9215113B1Link training in a communication portINTEL CORP·Filed 2014·Granted Dec 15, 2015·6 cites·16 claims
- 1178US11276911B2High-density low-loss cable and connector assemblyINTEL CORP·Filed 2018·Granted Mar 15, 2022·2 cites·20 claims
- 1277US10997016B2Method of encoding dataINTEL CORP·Filed 2019·Granted May 4, 2021·1 cites·21 claims
- 1377US10978407B2Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling sameINTEL CORP·Filed 2019·Granted Apr 13, 2021·2 cites·22 claims
- 1477US10158339B2Capacitive compensation structures using partially meshed ground planesINTEL CORP·Filed 2015·Granted Dec 18, 2018·2 cites·11 claims
- 1575US10079158B2Vertical trench routing in a substrateINTEL CORP·Filed 2014·Granted Sep 18, 2018·3 cites·17 claims
- 1674US9875210B2Method and apparatus of USB 3.1 retimer presence detect and indexINTEL CORP·Filed 2014·Granted Jan 23, 2018·2 cites·31 claims
- 1774US9223385B2Re-driver power managementINTEL CORP·Filed 2012·Granted Dec 29, 2015·3 cites·30 claims
- 1874US7427719B2Shifted segment layout for differential signal traces to mitigate bundle weave effectINTEL CORP·Filed 2006·Granted Sep 23, 2008·4 cites·3 claims
- 1972US12372574B2Skew detection and compensation for high speed I/O linksINTEL CORP·Filed 2021·Granted Jul 29, 2025·0 cites·17 claims
- 2072US11422642B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2021·Granted Aug 23, 2022·0 cites·42 claims
- 2172US10089270B2Interchangeable power and signal contacts for IO connectorsMOONEY STEPHEN R·Filed 2011·Granted Oct 2, 2018·3 cites·20 claims
- 2271US11614811B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2021·Granted Mar 28, 2023·0 cites·19 claims
- 2370US11347580B2Method of encoding dataINTEL CORP·Filed 2021·Granted May 31, 2022·0 cites·21 claims
- 2470US11061492B2Gyratory sensing system to enhance wearable device user experience via HMI extensionINTEL CORP·Filed 2020·Granted Jul 13, 2021·0 cites·22 claims
- 2569US10108227B2Techniques for providing an interface component for a wearable deviceINTEL CORP·Filed 2015·Granted Oct 23, 2018·1 cites·23 claims
- 2669US6672902B2Reducing electromagnetic interference (EMI) emissionsINTEL CORP·Filed 2001·Granted Jan 6, 2004·19 cites·26 claims
- 2768US9525441B2Common mode noise introduction to reduce radio frequency interferenceINTEL CORP·Filed 2014·Granted Dec 20, 2016·2 cites·21 claims
- 2868US7800459B2Ultra-high bandwidth interconnect for data transmissionINTEL CORP·Filed 2006·Granted Sep 21, 2010·3 cites·34 claims
- 2968US7723618B2Shifted segment layout for differential signal traces to mitigate bundle weave effectINTEL CORP·Filed 2008·Granted May 25, 2010·2 cites·17 claims
- 3068US5509196AMethod of fabricating a flex laminate packageIBM·Filed 1994·Granted Apr 23, 1996·24 cites·3 claims
- 3167US9312908B2Universal IO connector and interface capable of both wired and wireless operationMOONEY STEPHEN R·Filed 2011·Granted Apr 12, 2016·2 cites·36 claims
- 3266US9654342B2Bandwidth configurable IO connectorJAUSSI JAMES E·Filed 2011·Granted May 16, 2017·2 cites·37 claims
- 3361US9804646B2Host controlled IO power managementJAUSSI JAMES E·Filed 2011·Granted Oct 31, 2017·1 cites·24 claims
- 3458US9391378B2High bandwidth connector for internal and external IO interfacesLEDDIGE MICHAEL·Filed 2011·Granted Jul 12, 2016·4 cites·11 claims
- 3557US9800001B2Rate scalable connector for high bandwidth consumer applicationsINTEL CORP·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
- 3657US9326380B2Universal serial bus hybrid footprint designINTEL CORP·Filed 2012·Granted Apr 26, 2016·0 cites·20 claims
- 3755US2025210894A1Grid array electrical connectorsINTEL CORP·Filed 2023·Application pending·0 cites
- 3854US9489333B2Adaptive termination scheme for low power high speed busINTEL CORP·Filed 2014·Granted Nov 8, 2016·0 cites·19 claims
- 3953US9362684B2Rate scalable connector for high bandwidth consumer applicationsJAUSSI JAMES E·Filed 2011·Granted Jun 7, 2016·2 cites·14 claims
- 4053US7977581B2Shifted segment layout for differential signal traces to mitigate bundle weave effectINTEL CORP·Filed 2010·Granted Jul 12, 2011·0 cites·4 claims
- 4153US2022336986A1Gold finger design for differential edge cardsINTEL CORP·Filed 2022·Application pending·0 cites
- 4252US12425678B2Low latency communication path for audio/visual (A/V) applicationsINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 4352US8732942B2Method of forming a high speed interconnectHALL STEPHEN H·Filed 2008·Granted May 27, 2014·0 cites·12 claims
- 4451US12348340B2Equalizer settings for a re-driverINTEL CORP·Filed 2020·Granted Jul 1, 2025·0 cites·19 claims
- 4550US2022121594A1Soc architecture to reduce memory bandwidth bottlenecks and facilitate power managementINTEL CORP·Filed 2021·Application pending·0 cites
- 4649US12355558B2System, apparatus and method for communicating with a variable bit error rateINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 4749US9552995B2Electrical interconnect for an electronic packageINTEL CORP·Filed 2014·Granted Jan 24, 2017·0 cites·24 claims
- 4848US2024329715A1Encoding differential signals for power and noise reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 4947US10372527B2Method of encoding dataINTEL CORP·Filed 2013·Granted Aug 6, 2019·0 cites·25 claims
- 5047US2007145595A1High speed interconnectHALL STEPHEN H·Filed 2005·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →