Inventor · disambiguated record

Hon-Lin Huang

Also filed as: HUANG HON-LIN

52 granted patents·5 pending applications·391 citations·filing 2007–2025

98Inventor score

Technology areasH10W H10P H10D H01F

Files withTAIWAN SEMICONDUCTOR MFG CO LTD45 TAIWAN SEMICONDUCTOR MFG4 HUANG HON-LIN3 HSU KUO-CHING1 LAI YI-JEN1

Top patents by PatentIndex Score

57 records

0198US7928534B2Bond pad connection to redistribution lines having tapered profilesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 19, 2011·66 cites·20 claims
0297US7633165B2Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSVTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2008·Granted Dec 15, 2009·188 cites·18 claims
0396US8158489B2Formation of TSV backside interconnects by modifying carrier wafersHUANG HON-LIN·Filed 2010·Granted Apr 17, 2012·47 cites·16 claims
0494US8736050B2Front side copper post joint structure for temporary bond in TSV applicationHUANG HON-LIN·Filed 2010·Granted May 27, 2014·23 cites·14 claims
0593US10868106B2Semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·5 cites·20 claims
0693US10720487B2Structure and formation method of semiconductor device with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·6 cites·20 claims
0791US11749711B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·1 cites·20 claims
0890US10756162B2Structure and formation method of semiconductor device with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·3 cites·20 claims
0989US11621317B2Semiconductor device structure with magnetic element covered by polymer materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
1089US11387168B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·2 cites·20 claims
1189US2025301673A1Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1289US2024363676A1Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1386US12376317B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
1485US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
1585US8759949B2Wafer backside structures having copper pillarsYU CHEN-HUA·Filed 2010·Granted Jun 24, 2014·8 cites·11 claims
1684US12074193B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
1784US8461045B2Bond pad connection to redistribution lines having tapered profilesHSU KUO-CHING·Filed 2011·Granted Jun 11, 2013·6 cites·20 claims
1882US2025062194A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1981US10263064B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 16, 2019·3 cites·20 claims
2080US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
2178US10163781B1Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
2277US12347722B2Semiconductor device structure with a protection cap at an end portion of a conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
2377US9773779B2Semiconductor structure with resistor layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·2 cites·20 claims
2477US8097953B2Three-dimensional integrated circuit stacking-joint interface structureTSENG MING-HONG·Filed 2008·Granted Jan 17, 2012·8 cites·20 claims
2575US12159812B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
2675US11908885B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
2775US11557508B2Semiconductor device structure having protection caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
2875US10269703B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
2974US11233116B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
3074US9349699B2Front side copper post joint structure for temporary bond in TSV applicationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 24, 2016·2 cites·20 claims
3173US10763140B2Semiconductor processing stationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·7 claims
3273US10741477B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
3373US8541262B2Die edge contacts for semiconductor devicesLAI YI-JEN·Filed 2010·Granted Sep 24, 2013·3 cites·19 claims
3472US11081459B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
3571US11177228B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·1 cites·20 claims
3671US10483226B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·1 cites·14 claims
3770US11908818B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
3870US11329124B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
3969US2024347578A1Manufacturing method of semiconductor device with inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4068US11462425B2Semiconductor processing stationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
4168US11094776B2Structure and formation method of semiconductor device with magnetic element covered by polymer materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
4263US10290697B2Magnetic core inductor semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·0 cites·20 claims
4359US10084032B2Semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 25, 2018·0 cites·20 claims
4458US10510661B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
4557US12057468B2Semiconductor device with inductor windings around a core above an encapsulated dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
4657US10748810B2Method of manufacturing an integrated inductor with protections caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
4755US11127703B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
4855US10319695B2Semiconductor device and bump formation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
4955US10276561B2Semiconductor structure with resistor layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
5055US9190347B2Die edge contacts for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 17, 2015·0 cites·20 claims

Showing the top 50 of 57 patent records by PatentIndex Score.

Join the waitlist — get patent alerts

Get an alert when Hon-Lin Huang files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →