Inventor · disambiguated record
Hongkai Ji
Also filed as: JI HONGKAI
0 granted patents·3 pending applications·0 citations·filing 2022–2024
Top patents by PatentIndex Score
3 records- 0167US2025101492A1Mapping dna bindingUNIV JOHNS HOPKINS·Filed 2024·Application pending·0 cites
- 0257US2025015035A1A semiconductor structure and method making the sameCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 0356US2025006702A1Three-dimensional Stack Package Structure And Method Making The SameCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hongkai Ji files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →