Inventor · disambiguated record
Hong-Sheng Ke
Also filed as: KE HONG-SHENG
2 granted patents·1 pending application·3 citations·filing 2013–2016
39Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0164US8846453B1Semiconductor package structure and method of manufacturing the sameINPAQ TECHNOLOGY CO LTD·Filed 2013·Granted Sep 30, 2014·3 cites·7 claims
- 0242US11152320B2Semiconductor package structure and method of the sameINPAQ TECH CO LTD·Filed 2016·Granted Oct 19, 2021·0 cites·6 claims
- 0339US2017012010A1Semiconductor package structure and method of the sameINPAQ TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →