Inventor · disambiguated record
Hou-Chang Kuo
Also filed as: KUO HOU-CHANG
3 granted patents·1 pending application·63 citations·filing 2000–2011
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0186US6483187B1Heat-spread substrateADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Nov 19, 2002·61 cites·18 claims
- 0258US8497571B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jul 30, 2013·2 cites·6 claims
- 0334US8471372B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
- 0431US2002195721A1Cavity down ball grid array packaging structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →