Inventor · disambiguated record
Ho-Shing Lee
Also filed as: LEE HO-SHING
3 granted patents·2 pending applications·0 citations·filing 2017–2023
44Inventor score
Files withUNIMICRON TECHNOLOGY CORP5
Top patents by PatentIndex Score
5 records- 0155US10856421B2Circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Dec 1, 2020·0 cites·4 claims
- 0254US2025149392A1Package substrate and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 0349US11153963B2Circuit carrier structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 19, 2021·0 cites·15 claims
- 0448US10512165B2Method for manufacturing a circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 17, 2019·0 cites·7 claims
- 0543US2022157687A1Circuit substrate with heat dissipation block and packaging structure having the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →