Inventor · disambiguated record
Hong Wan Ng
Also filed as: NG HONG WAN
61 granted patents·39 pending applications·131 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
100 records- 0197US11282811B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0296US11309281B2Overlapping die stacks for NAND package architectureMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 19, 2022·5 cites·19 claims
- 0393US12237301B2Through stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 25, 2025·2 cites·20 claims
- 0492US9761562B2Semiconductor device packages including a controller elementMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 12, 2017·7 cites·16 claims
- 0591US10522507B2Semiconductor device assemblies including multiple shingled stacks of semiconductor diesMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 31, 2019·6 cites·9 claims
- 0691US9418974B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·9 cites·18 claims
- 0789US10312219B2Semiconductor device assemblies including multiple shingled stacks of semiconductor diesMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·5 cites·14 claims
- 0889US9627367B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 18, 2017·7 cites·29 claims
- 0989US9406660B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Aug 2, 2016·7 cites·14 claims
- 1088US11929351B2Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layerMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 12, 2024·1 cites·20 claims
- 1188US9985000B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted May 29, 2018·4 cites·13 claims
- 1287US12148736B2Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 19, 2024·1 cites·20 claims
- 1387US8923004B2Microelectronic packages with small footprints and associated methods of manufacturingLOW PENG WANG·Filed 2008·Granted Dec 30, 2014·43 cites·6 claims
- 1484US11527459B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·1 cites·9 claims
- 1583US2024274583A1Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1682US8754537B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2011·Granted Jun 17, 2014·4 cites·4 claims
- 1782US2024128254A1Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1881US10727206B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 28, 2020·2 cites·24 claims
- 1980US12444709B2Overlapping die stacks for NAND package architectureMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 14, 2025·0 cites·17 claims
- 2080US12315769B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2022·Granted May 27, 2025·0 cites·19 claims
- 2180US12243807B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 2280US10504881B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 10, 2019·2 cites·13 claims
- 2380US10128217B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·2 cites·25 claims
- 2480US10014281B2Methods of manufacturing a semiconductor device package including a controller elementMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 3, 2018·2 cites·20 claims
- 2579US12293992B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2023·Granted May 6, 2025·0 cites·19 claims
- 2678US2025259972A1Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2777US8174101B2Microelectronic devices and microelectronic support devices, and associated assemblies and methodsLEE TECK KHENG·Filed 2005·Granted May 8, 2012·7 cites·18 claims
- 2877US2025349656A1Apparatus including direct-contact heat paths and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2976US11894289B2Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 3076US11101262B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 3176US10658336B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 19, 2020·1 cites·10 claims
- 3276US8637987B2Semiconductor assemblies with multi-level substrates and associated methods of manufacturingCHONG CHIN HUI·Filed 2011·Granted Jan 28, 2014·4 cites·17 claims
- 3376US2025336796A1Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3475US11824044B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 3575US10304808B2Semiconductor devices including a controller and methods of forming such devicesMICRON TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·1 cites·20 claims
- 3675US2025349748A1Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3775US2025079405A1Three-dimensional bonding scheme and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3874US11855065B2Stacked semiconductor die assemblies with support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 3974US2025329626A1Microelectronic device packagesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4074US2025309194A1Cross stack bridge bonding devices and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4173US11908833B2Overlapping die stacks for nand package architectureMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 4273US11367667B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·17 claims
- 4373US10593607B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 17, 2020·1 cites·13 claims
- 4472US11101244B2Stacked semiconductor die assemblies with die support members and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 24, 2021·0 cites·12 claims
- 4570US12432859B2Surface mount device bonded to an inner layer of a multi-layer substrateMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 30, 2025·0 cites·17 claims
- 4670US12374612B2Microelectronic device packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 29, 2025·0 cites·27 claims
- 4770US11658154B2Memory devices with controllers under memory packages and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·23 claims
- 4870US2025336737A1Semiconductor devices with flexible spacerMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4969US12368113B2Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 5069US11710722B2Semiconductor assemblies with systems and methods for managing high die stack structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →