Inventor · disambiguated record
Hock Lye John Pang
Also filed as: PANG HOCK LYE JOHN
1 granted patent·1 pending application·14 citations·filing 2008–2020
36Inventor score
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2 records- 0174US8462516B2Interconnect structure and a method of fabricating the sameWONG CHEE KHUEN STEPHEN·Filed 2008·Granted Jun 11, 2013·14 cites·3 claims
- 0242US2022184699A1Method of fabricating an interfacial structure and a fabricated interfacial structureUNIV NANYANG TECH·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →