Interconnect structure and a method of fabricating the same

Abstract

An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.

The invention claimed is: 
     
       1. A micro device interconnect structure for interconnecting a multiple component stack and a substrate, the interconnect structure comprising:
 a first base portion formed on a first mounting surface of a first component of the stack; 
 a first pillar portion extending from the first base portion and substantially perpendicularly to the first mounting surface; and 
 a first head portion formed on the first pillar portion and having larger lateral dimensions than the first pillar portion; 
 a second base portion formed on a second mounting surface of a second component of the stack; 
 a second pillar portion extending from the second base portion and substantially perpendicularly to the second mounting surface; and 
 a second head portion formed on the second pillar portion and having larger lateral dimensions than the second pillar portion; 
 a first and a second contact pad formed on a mounting surface of the substrate; and 
 a connection for connecting the first and second head portions to the first and second contact pads respectively; 
 wherein the base portions and the pillar portions are integrally formed of a homogeneous material pillar and the first pillar portion is higher than the second pillar portion. 
 
     
     
       2. The interconnect structure of  claim 1 , further comprising a spacer disposed between the first and second components of the stack. 
     
     
       3. The interconnect structure of  claim 1 , wherein the connection for connecting the head portion of the interconnect structure to the contact pad comprises one or more of a group consisting of solder, adhesive bonding, surface activated bonding, compression bonding and diffusion bonding.