Inventor · disambiguated record
Hojun Seong
Also filed as: SEONG HOJUN
7 granted patents·3 pending applications·13 citations·filing 2011–2025
77Inventor score
Top patents by PatentIndex Score
10 records- 0194US11792982B2Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·3 cites·15 claims
- 0288US8975684B2Methods of forming non-volatile memory devices having air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 10, 2015·8 cites·9 claims
- 0379US12274062B2Three-dimensional semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 8, 2025·1 cites·20 claims
- 0469US2024015970A1Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0568US9997525B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·1 cites·20 claims
- 0657US2025185249A1Three-dimensional semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0756US9041088B2Non-volatile memory devices having air gaps and methods of manufacturing the sameSIM JAE-HWANG·Filed 2014·Granted May 26, 2015·0 cites·21 claims
- 0850US9773795B2Semiconductor devices having airgaps and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·11 claims
- 0938US2012058639A1Semiconductor devices and methods of fabricating the sameSIM JAE-HWANG·Filed 2011·Application pending·0 cites
- 1034US9508551B2Method of fabricating a semiconductor device and a semiconductor device fabricated by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 29, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →