Inventor · disambiguated record
Hong-Seong Son
Also filed as: SON HONG-SEONG
15 granted patents·10 pending applications·179 citations·filing 1999–2008
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20HONG UK-SUN1LEE SUNG-BAE1PARK MOO-YONG1SAMSUNG ELECTRONICS OO LTD1
Top patents by PatentIndex Score
25 records- 0190US7488235B2Polishing apparatus and related polishing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·17 cites·16 claims
- 0283US6983755B2Cleaning method and cleaning apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 10, 2006·27 cites·15 claims
- 0378US7066785B2Polishing apparatus and related polishing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 27, 2006·21 cites·17 claims
- 0477US7365021B2Methods of fabricating a semiconductor device using an organic compound and fluoride-based buffered solutionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 29, 2008·10 cites·30 claims
- 0573US6924207B2Method of fabricating a metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 2, 2005·18 cites·20 claims
- 0672US8062102B2Polishing pads including slurry and chemicals thereon and methods of fabricating the samePARK MOO-YONG·Filed 2004·Granted Nov 22, 2011·18 cites·27 claims
- 0772US7645695B2Method of manufacturing a semiconductor elementSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 12, 2010·3 cites·20 claims
- 0868US6976902B2Chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 20, 2005·12 cites·20 claims
- 0967US7807337B2Inductor for a system-on-a-chip and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 5, 2010·4 cites·17 claims
- 1065US7183226B2Method of forming a trench for use in manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 27, 2007·11 cites·20 claims
- 1160US6924234B2Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 2, 2005·6 cites·21 claims
- 1259US6228739B1Pre-treatment method performed on a semiconductor structure before forming hemi-spherical grains of capacitor storage nodeSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted May 8, 2001·28 cites·18 claims
- 1353US8043960B2Contact structure of semiconductor devices and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 25, 2011·0 cites·22 claims
- 1453US2008166851A1Metal-insulator-metal (mim) capacitor and method for fabricating the sameHONG UK-SUN·Filed 2008·Application pending·0 cites
- 1551US7180188B2Contact structure of semiconductor devices and method of fabricating the sameSAMSUNG ELECTRONICS OO LTD·Filed 2004·Granted Feb 20, 2007·4 cites·8 claims
- 1648US2006076034A1Cleaning method and cleaning apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1747US2007117378A1Method of forming a trench for use in manufacturing a semiconductor deviceLEE SUNG-BAE·Filed 2007·Application pending·0 cites
- 1846US2006270228A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1946US2005148292A1Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 2041US2003231458A1Metal-insulator-metal (MIM) capacitor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
- 2139US2005070090A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 2239US2005090094A1Method of forming a metal pattern for a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 2338US7026242B2Method for filling a hole with a metalSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 11, 2006·0 cites·22 claims
- 2437US2005116317A1Inductor for a system-on-a-chip and method for manufacturing the sameFiled 2004·Application pending·0 cites
- 2537US2004171277A1Method of forming a conductive metal line over a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →