Inventor · disambiguated record
Hoshiaki Terao
Also filed as: TERAO HOSHIAKI
8 granted patents·1 pending application·9 citations·filing 2005–2020
76Inventor score
Top patents by PatentIndex Score
9 records- 0169US12030122B2Method of manufacturing soft magnetic dust coreJFE STEEL CORP·Filed 2020·Granted Jul 9, 2024·0 cites·18 claims
- 0267US7955448B2Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloyJFE PREC CORP·Filed 2005·Granted Jun 7, 2011·6 cites·10 claims
- 0358US9299636B2Heat sink for electronic device and process for production thereofTERAO HOSHIAKI·Filed 2010·Granted Mar 29, 2016·3 cites·16 claims
- 0458US2018361474A9Method of manufacturing soft magnetic dust core and soft magnetic dust coreJFE STEEL CORP·Filed 2016·Application pending·0 cites
- 0553US11635120B2Sintered friction material for brakeSUNSTAR ENGINEERING INC·Filed 2018·Granted Apr 25, 2023·0 cites·15 claims
- 0646US12130096B2Heat sink, semiconductor package and semiconductor moduleJFE PREC CORPORATION·Filed 2020·Granted Oct 29, 2024·0 cites·11 claims
- 0743US11646243B2Heat sink and method for manufacturing sameJFE PREC CORPORATION·Filed 2018·Granted May 9, 2023·0 cites·19 claims
- 0843US11270926B2Heat sink and method for manufacturing sameJFE PREC CORPORATION·Filed 2017·Granted Mar 8, 2022·0 cites·24 claims
- 0939US8557015B2Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductorTERAO HOSHIAKI·Filed 2007·Granted Oct 15, 2013·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →