Inventor · disambiguated record
Horst Theuss
Also filed as: THEUSS HORST
201 granted patents·34 pending applications·1,916 citations·filing 2002–2025
99Inventor score
Top patents by PatentIndex Score
235 records- 0198US9978720B2Insulated dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 22, 2018·39 cites·4 claims
- 0298US9593009B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 14, 2017·46 cites·23 claims
- 0398US9164156B2Apparatus having a back-bias magnet and a semiconductor chip elementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 20, 2015·56 cites·15 claims
- 0498US8080993B2Sensor module with mold encapsulation for applying a bias magnetic fieldTHEUSS HORST·Filed 2008·Granted Dec 20, 2011·67 cites·20 claims
- 0597US9513261B2Photoacoustic gas sensor device and a method for analyzing gasINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 6, 2016·22 cites·17 claims
- 0697US8362579B2Semiconductor device including a magnetic sensor chipINFINEON TECHNOLOGIES AG·Filed 2009·Granted Jan 29, 2013·58 cites·23 claims
- 0797US8253210B2Semiconductor device including a magnetic sensor chipTHEUSS HORST·Filed 2009·Granted Aug 28, 2012·59 cites·22 claims
- 0897US8106654B2Magnetic sensor integrated circuit device and methodTHEUSS HORST·Filed 2008·Granted Jan 31, 2012·55 cites·22 claims
- 0997US7385394B2Integrated magnetic sensor componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 10, 2008·108 cites·21 claims
- 1096US11899047B1Magnetic field shaping for magnetic field current sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 13, 2024·3 cites·32 claims
- 1196US10495612B2Photoacoustic gas sensor device and a method for analyzing gasINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 3, 2019·8 cites·17 claims
- 1296US10241088B2Photo-acoustic gas sensor module having light emitter and detector unitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 26, 2019·13 cites·9 claims
- 1396US9446944B2Sensor apparatus and method for producing a sensor apparatusINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 20, 2016·19 cites·19 claims
- 1496US9239386B2Sonic sensors and packagesELIAN KLAUS·Filed 2011·Granted Jan 19, 2016·13 cites·13 claims
- 1596US9070615B2Method for making a sensor device using a graphene layerINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 30, 2015·20 cites·25 claims
- 1696US8952489B2Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 10, 2015·51 cites·20 claims
- 1796US8759153B2Method for making a sensor device using a graphene layerELIAN KLAUS·Filed 2011·Granted Jun 24, 2014·23 cites·25 claims
- 1895US11275059B2Apparatus and method for in-situ calibration of a photoacoustic sensorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 15, 2022·7 cites·20 claims
- 1995US10753858B2Wafer arrangementINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 25, 2020·7 cites·20 claims
- 2095US10527589B2Apparatus and method for in-situ calibration of a photoacoustic sensorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 7, 2020·7 cites·21 claims
- 2195US9952110B2Multi-die pressure sensor packageINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 24, 2018·12 cites·19 claims
- 2295US8841785B2Energy harvesterTHEUSS HORST·Filed 2008·Granted Sep 23, 2014·45 cites·16 claims
- 2395US8809973B2Chip package comprising a microphone structure and a method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 19, 2014·19 cites·21 claims
- 2495US8350381B2Device and method for manufacturing a deviceINFINEON TECHNOLOGIES AG·Filed 2010·Granted Jan 8, 2013·18 cites·24 claims
- 2594US12122667B2Sensor devices with gas-permeable cover and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Oct 22, 2024·1 cites·17 claims
- 2694US11860272B2Ultrasonic touch sensorINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 2, 2024·4 cites·20 claims
- 2794US9818665B2Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfacesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 14, 2017·12 cites·4 claims
- 2894US9536953B2Method for making a sensor device using a graphene layerINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·9 cites·29 claims
- 2994US9432759B2Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signalsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 30, 2016·16 cites·4 claims
- 3094US7569427B2Semiconductor component with connecting elements and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 4, 2009·30 cites·22 claims
- 3194US7268436B2Electronic device with cavity and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 11, 2007·125 cites·6 claims
- 3293US9728652B2Sensor device and methodELIAN KLAUS·Filed 2012·Granted Aug 8, 2017·14 cites·18 claims
- 3393US7932599B2Semiconductor component of semiconductor chip size with flip-chip-like external contactsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 26, 2011·26 cites·12 claims
- 3493US7851925B2Wafer level packaged MEMS integrated circuitINFINEON TECHNOLOGIES AG·Filed 2008·Granted Dec 14, 2010·32 cites·15 claims
- 3593US7472587B1Tire deformation detectionINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 6, 2009·40 cites·24 claims
- 3692US9998812B2Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signalsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 12, 2018·8 cites·12 claims
- 3792US9884757B2MEMS sensor package systems and methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 6, 2018·11 cites·21 claims
- 3892US9013013B1Pressure sensor package having a stacked die arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·16 cites·22 claims
- 3992US6867492B2Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·96 cites·10 claims
- 4091US10365208B2Gas sensorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 30, 2019·4 cites·11 claims
- 4191US9209497B2Sensor module and battery elementsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 8, 2015·6 cites·18 claims
- 4291US8618620B2Pressure sensor package systems and methodsWINKLER BERNHARD·Filed 2010·Granted Dec 31, 2013·13 cites·19 claims
- 4391US7775115B2Sensor component and method for producing a sensor componentINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 17, 2010·25 cites·35 claims
- 4491US7221048B2Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrierINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·26 cites·16 claims
- 4591US7163843B2Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 16, 2007·60 cites·4 claims
- 4690US11876007B2Hermetically sealed housing with a semiconductor component and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 16, 2024·1 cites·20 claims
- 4790US8559139B2Sensor module and method for manufacturing a sensor moduleTHEUSS HORST·Filed 2007·Granted Oct 15, 2013·20 cites·20 claims
- 4890US8373240B2Sensor device having a structure elementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 12, 2013·9 cites·12 claims
- 4990US7952185B2Semiconductor device with hollow structureINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 31, 2011·17 cites·13 claims
- 5090US7732915B2Semiconductor sensor device with sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 8, 2010·17 cites·16 claims
Showing the top 50 of 235 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →