Inventor · disambiguated record
Hong Wang
Also filed as: WANG HONG · WANG HONG-LIANG
39 granted patents·5 pending applications·580 citations·filing 2001–2016
98Inventor score
Top patents by PatentIndex Score
44 records- 0196US6776873B1Yttrium oxide based surface coating for semiconductor IC processing vacuum chambersFiled 2002·Granted Aug 17, 2004·153 cites·6 claims
- 0295US6565984B1Clean aluminum alloy for semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2002·Granted May 20, 2003·70 cites·24 claims
- 0392US7456113B2Cleaning method and solution for cleaning a wafer in a single wafer processAPPLIED MATERIALS INC·Filed 2005·Granted Nov 25, 2008·23 cites·20 claims
- 0490US6902628B2Method of cleaning a coated process chamber componentAPPLIED MATERIALS INC·Filed 2002·Granted Jun 7, 2005·41 cites·11 claims
- 0588US9444196B2Electrical connectorMOLEX LLC·Filed 2015·Granted Sep 13, 2016·9 cites·9 claims
- 0688US7208325B2Refreshing wafers having low-k dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·13 cites·7 claims
- 0788US6713188B2Clean aluminum alloy for semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2003·Granted Mar 30, 2004·27 cites·33 claims
- 0887US9048594B2Dual SIM card connectorMOLEX INC·Filed 2013·Granted Jun 2, 2015·17 cites·14 claims
- 0986US9378436B2Low profile connectorMOLEX LLC·Filed 2014·Granted Jun 28, 2016·8 cites·11 claims
- 1086US7238052B2Card connector with anti-mismating deviceHON HAI PREC IND CO LTD·Filed 2006·Granted Jul 3, 2007·15 cites·9 claims
- 1186US6902627B2Cleaning chamber surfaces to recover metal-containing compoundsAPPLIED MATERIALS INC·Filed 2003·Granted Jun 7, 2005·26 cites·14 claims
- 1284US7618769B2Textured chamber surfaceAPPLIED MATERIALS INC·Filed 2004·Granted Nov 17, 2009·21 cites·13 claims
- 1383US7048814B2Halogen-resistant, anodized aluminum for use in semiconductor processing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted May 23, 2006·16 cites·4 claims
- 1481US7402520B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2004·Granted Jul 22, 2008·23 cites·15 claims
- 1580US8142989B2Textured chamber surfaceBRUECKNER KARL·Filed 2009·Granted Mar 27, 2012·5 cites·8 claims
- 1679US7964085B1Electrochemical removal of tantalum-containing materialsAPPLIED MATERIALS INC·Filed 2004·Granted Jun 21, 2011·10 cites·26 claims
- 1779US6656535B2Method of fabricating a coated process chamber componentAPPLIED MATERIALS INC·Filed 2001·Granted Dec 2, 2003·19 cites·16 claims
- 1878US6899798B2Reusable ceramic-comprising component which includes a scrificial surface layerAPPLIED MATERIALS INC·Filed 2001·Granted May 31, 2005·18 cites·16 claims
- 1976US9515400B2Micro SIM card connectorMOLEX LLC·Filed 2015·Granted Dec 6, 2016·4 cites·29 claims
- 2075US7951718B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 2173US6944006B2Guard for electrostatic chuckAPPLIED MATERIALS INC·Filed 2003·Granted Sep 13, 2005·18 cites·15 claims
- 2270US7318733B2Card connector with ejectorHON HAI PREC IND CO LTD·Filed 2006·Granted Jan 15, 2008·4 cites·14 claims
- 2368US9614312B2Terminal and electrical connectorMOLEX LLC·Filed 2016·Granted Apr 4, 2017·2 cites·14 claims
- 2468US9053369B2Connector with articulating actuatorMOLEX INC·Filed 2013·Granted Jun 9, 2015·2 cites·14 claims
- 2565US7657390B2Reclaiming substrates having defects and contaminantsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 2, 2010·2 cites·34 claims
- 2662US7033447B2Halogen-resistant, anodized aluminum for use in semiconductor processing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Apr 25, 2006·8 cites·2 claims
- 2760US7185760B2Non-contact protective packaging for surface-sensitive articlesAPPLIED MATERIALS INC·Filed 2003·Granted Mar 6, 2007·6 cites·3 claims
- 2859US9068273B2Electrochemical removal of tantalum-containing materialsWANG HONG·Filed 2011·Granted Jun 30, 2015·0 cites·11 claims
- 2957US7699655B2Electrical connector having a shielding shellHON HAI PREC INC CO LTD·Filed 2008·Granted Apr 20, 2010·5 cites·18 claims
- 3054US2008213496A1Method of coating semiconductor processing apparatus with protective yttrium-containing coatingsAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3152US9308551B2Surface treatment method for substrate and housing manufactured by the sameSHENZHEN FUTAIHONG PREC IND CO·Filed 2013·Granted Apr 12, 2016·0 cites·6 claims
- 3248US2006188742A1Chamber component having grooved surfaceAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3346US9502803B2Terminal and electrical connectorMOLEX LLC·Filed 2015·Granted Nov 22, 2016·0 cites·14 claims
- 3446US7695982B2Refurbishing a wafer having a low-k dielectric layerAPPLIED MATREIALS INC·Filed 2007·Granted Apr 13, 2010·0 cites·22 claims
- 3545USD591687SElectrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted May 5, 2009·5 cites·1 claims
- 3644US2013101860A1Method for joining aluminum part and resin and composite made by sameZhou shu-xiang·Filed 2012·Application pending·0 cites
- 3742US9787007B2Electronic card connectorMOLEX LLC·Filed 2016·Granted Oct 10, 2017·0 cites·10 claims
- 3842USD583331SElectrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted Dec 23, 2008·4 cites·1 claims
- 3941US9640892B2Electronic card connectorMOLEX LLC·Filed 2016·Granted May 2, 2017·0 cites·10 claims
- 4040US2013161195A1Electroplating method and article made by sameYan shi-jie·Filed 2012·Application pending·0 cites
- 4137US10943704B2Baffle structure for channelUNIV TSINGHUA·Filed 2016·Granted Mar 9, 2021·0 cites·10 claims
- 4236US9865947B2SIM connectorMOLEX LLC·Filed 2016·Granted Jan 9, 2018·0 cites·10 claims
- 4336US2003188685A1Laser drilled surfaces for substrate processing chambersAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4435USD591242SElectrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted Apr 28, 2009·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →