Inventor · disambiguated record
Hongbo Yang
Also filed as: WONG LIMING · YANG HONGBO
17 granted patents·12 pending applications·104 citations·filing 2005–2025
92Inventor score
Files withGEM SERVICES INC11TSUI ANTHONY C3GRIREM ADVANCED MAT CO LTD2HARNDEN JAMES2HUAWEI TECH CO LTD2
Top patents by PatentIndex Score
29 records- 0193US8015543B1Hardware specific code generationMATHWORKS INC·Filed 2007·Granted Sep 6, 2011·35 cites·37 claims
- 0291US12081550B1Machine learning-based URL categorization system with selection between more and less specific category labelsNETSKOPE INC·Filed 2023·Granted Sep 3, 2024·7 cites·20 claims
- 0387US7838339B2Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2008·Granted Nov 23, 2010·14 cites·19 claims
- 0472US8701081B2Hardware specific code generationCARRICK JAMES E·Filed 2011·Granted Apr 15, 2014·4 cites·25 claims
- 0568US8106493B2Semiconductor device package having features formed by stampingTSUI ANTHONY C·Filed 2010·Granted Jan 31, 2012·3 cites·20 claims
- 0668US7545906B2Method and system for binocular steroscopic scanning radiographic imagingNUCTECH CO LTD·Filed 2007·Granted Jun 9, 2009·2 cites·21 claims
- 0767US9641673B2Method, network element, and system for assessing voice qualityHUAWEI TECH CO LTD·Filed 2015·Granted May 2, 2017·2 cites·13 claims
- 0866USD588080S2021-8J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 10, 2009·16 cites·1 claims
- 0965US2025112924A1Selection between sensitive and non-sensitive category labels by machine learning-based url categorization systemNETSKOPE INC·Filed 2024·Application pending·0 cites
- 1064US12321573B2System and method for processing and presenting popularity dataLENOVO BEIJING LTD·Filed 2023·Granted Jun 3, 2025·0 cites·17 claims
- 1160US2025188593A1Rare earth rotary target and preparation method thereforGRIREM ADVANCED MAT CO LTD·Filed 2025·Application pending·0 cites
- 1257US2025191818A1Co-sputtering rare earth rotating target material, and preparation method, and application method thereforGRIREM ADVANCED MAT CO LTD·Filed 2025·Application pending·0 cites
- 1356US8097945B2Bi-directional, reverse blocking battery switchHARNDEN JAMES·Filed 2007·Granted Jan 17, 2012·2 cites·17 claims
- 1454US8260598B2Size vector sharing in code generated for variable-sized signalsYANG HONGBO·Filed 2007·Granted Sep 4, 2012·2 cites·31 claims
- 1554USD588557S4040-28J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 17, 2009·10 cites·1 claims
- 1648US9419866B2Method, node, and monitoring center detecting network faultHUAWEI TECH CO LTD·Filed 2013·Granted Aug 16, 2016·0 cites·28 claims
- 1746US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 1841US2008111219A1Package designs for vertical conduction dieGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 1940US8558368B2Bi-directional, reverse blocking battery switchCHIA ANTHONY·Filed 2011·Granted Oct 15, 2013·0 cites·18 claims
- 2039USD560623SQuad-24JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 29, 2008·4 cites·1 claims
- 2139US2013017652A1Method of manufacturing a semiconductor device package with a heatsinkGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 2239US2013009297A1Semiconductor device package having configurable lead frame fingersGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 2339US2013009296A1Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2012·Application pending·0 cites
- 2439US2011291254A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsHARNDEN JAMES·Filed 2011·Application pending·0 cites
- 2538US2007130759A1Semiconductor device package leadframe formed from multiple metal layersGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 2636USD558694SQuad-28JW surface mount packageGEM SERVICES INC·Filed 2005·Granted Jan 1, 2008·3 cites·1 claims
- 2734US2012181677A1Semiconductor device package with two component lead frameTSUI ANTHONY C·Filed 2012·Application pending·0 cites
- 2834US2012181676A1Power semiconductor device packagingTSUI ANTHONY C·Filed 2012·Application pending·0 cites
- 2931US10731721B2Elastic adjustable brake pad for use in trainBEIJING BEI MO GAO KE FRICTION MAT CO LTD·Filed 2017·Granted Aug 4, 2020·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →