Inventor · disambiguated record
Hongwen Zhang
Also filed as: ZHANG HONGWEN
16 granted patents·3 pending applications·46 citations·filing 2003–2025
89Inventor score
Files withINDIUM CORP12WEDGE NETWORKS INC2INST AUTOMATION CAS1JUNIPER NETWORKS INC1WUXI INFIMOTION PROPULSION TECH CO LTD1
Top patents by PatentIndex Score
19 records- 0188US11267080B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2019·Granted Mar 8, 2022·5 cites·19 claims
- 0288US7630379B2Systems and methods for improved network based content inspectionWEDGE NETWORKS INC·Filed 2007·Granted Dec 8, 2009·29 cites·19 claims
- 0384US11752579B2High reliability leadfree solder alloys for harsh service conditionsINDIUM CORP·Filed 2020·Granted Sep 12, 2023·1 cites·20 claims
- 0480US12240060B2SnIn solder alloysINDIUM CORP·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 0578US9636784B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted May 2, 2017·3 cites·34 claims
- 0677US10153967B2Deterministic and optimized bit index explicit replication (BIER) forwardingJUNIPER NETWORKS INC·Filed 2015·Granted Dec 11, 2018·3 cites·21 claims
- 0776US11738411B2Lead-free solder paste with mixed solder powders for high temperature applicationsINDIUM CORP·Filed 2021·Granted Aug 29, 2023·1 cites·18 claims
- 0872US11999018B2SnBi and SnIn solder alloysINDIUM CORP·Filed 2019·Granted Jun 4, 2024·0 cites·12 claims
- 0971US10888958B2Hybrid high temperature lead-free solder preformINDIUM CORP·Filed 2018·Granted Jan 12, 2021·2 cites·19 claims
- 1070US11712762B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2022·Granted Aug 1, 2023·0 cites·21 claims
- 1170US10328533B2Hybrid lead-free solder wireINDIUM CORP·Filed 2017·Granted Jun 25, 2019·0 cites·25 claims
- 1264US10118260B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted Nov 6, 2018·1 cites·27 claims
- 1363US9802274B2Hybrid lead-free solder wireINDIUM CORP·Filed 2016·Granted Oct 31, 2017·0 cites·22 claims
- 1456US9017446B2Mixed alloy solder pasteZHANG HONGWEN·Filed 2010·Granted Apr 28, 2015·1 cites·27 claims
- 1554US11436745B1Reconstruction method of three-dimensional (3D) human body model, storage device and control deviceINST AUTOMATION CAS·Filed 2019·Granted Sep 6, 2022·0 cites·20 claims
- 1650US2025247006A1Boost and buck apparatus and systemWUXI INFIMOTION PROPULSION TECH CO LTD·Filed 2025·Application pending·0 cites
- 1748US2022395936A1High reliability lead-free solder pastes with mixed solder alloy powdersINDIUM CORP·Filed 2022·Application pending·0 cites
- 1843US2005010697A1System for bandwidth detection and content switchingFiled 2003·Application pending·0 cites
- 1928US11349852B2Apparatus and methods for network-based line-rate detection of unknown malwareWEDGE NETWORKS INC·Filed 2017·Granted May 31, 2022·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →