Inventor · disambiguated record
Houde Zhou
Also filed as: ZHOU HOUDE
14 granted patents·9 pending applications·9 citations·filing 2019–2024
85Inventor score
Top patents by PatentIndex Score
23 records- 0194US11133290B2Chip package structure with stacked chips and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·8 cites·18 claims
- 0283US11688721B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0383US2025010402A1Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0483US2025010403A1Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0577US2025022850A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0677US2025096220A1Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0777US2025022851A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0876US12205940B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·19 claims
- 0975US12125827B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1072US12121995B2Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 1170US12489066B2Electromagnetic interference shielding package structures and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·17 claims
- 1270US12334361B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1366US12166012B2Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·14 claims
- 1466US11721686B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 1560US11694904B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1660US2022013471A1Ic packageYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 1757US11476173B2Manufacturing method of integrated circuit packaging structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1853US12131924B2Method for processing semiconductor wafersYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 29, 2024·0 cites·15 claims
- 1952US12106985B2Laser dicing system and method for dicing semiconductor structure including cutting streetYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 2050US11469153B2Electronic component comprising substrate with thermal indicatorYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·14 claims
- 2150US2020135656A1Ic packageYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 2250US2020235023A1Integrated circuit packaging structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 2339US2022275025A1Bone remodeling regulatory peptides and application thereof2ND XIANGYA HOSPITAL CENTRAL SOUTH UNIV·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →