Inventor · disambiguated record
Hsiao-Ming Chang
Also filed as: CHANG HSIAO Y · CHANG HSIAO-MING
3 granted patents·2 pending applications·3 citations·filing 2005–2021
55Inventor score
Top patents by PatentIndex Score
5 records- 0176US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0274US10743411B1Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the componentICP TECH CO LTD·Filed 2020·Granted Aug 11, 2020·1 cites·8 claims
- 0356US11928247B2Methods and devices for AI model integrity and secrecy protectionCVITEK CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·10 claims
- 0444US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 0528US2006054915A1Led packageSEN TECH CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →