Inventor · disambiguated record
Hsuan-Jui Chang
Also filed as: CHANG HSUAN-JUI
16 granted patents·5 pending applications·63 citations·filing 2000–2025
91Inventor score
Files withACER INC5ORIENT SEMICONDUCTOR ELECT LTD5WISTRON NEWEB CORP4MEDIATEK INC2IND TECH RES INST1
Top patents by PatentIndex Score
21 records- 0189US9325066B2Communication device and method for designing antenna element thereofIND TECH RES INST·Filed 2013·Granted Apr 26, 2016·12 cites·14 claims
- 0287US9980018B2Communication device with narrow-ground-clearance antenna elementACER INC·Filed 2016·Granted May 22, 2018·7 cites·11 claims
- 0381US11769939B2Electronic device and antenna structureWISTRON NEWEB CORP·Filed 2022·Granted Sep 26, 2023·1 cites·15 claims
- 0480US10866920B2Method and device for adjusting signal transmission direction in bidirectional ReDriver IC chipVIA LABS INC·Filed 2019·Granted Dec 15, 2020·3 cites·15 claims
- 0579US9124001B2Communication device and antenna element thereinACER INC·Filed 2013·Granted Sep 1, 2015·5 cites·8 claims
- 0674US2025202121A1Electronic device and antenna feeding moduleWISTRON NEWEB CORP·Filed 2025·Application pending·0 cites
- 0766US12424760B2AntennaMEDIATEK INC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0865US9853351B2Communication device with metal-frame half-loop antenna elementACER INC·Filed 2016·Granted Dec 26, 2017·1 cites·12 claims
- 0965US9178274B2Communication device and antenna element thereinACER INC·Filed 2013·Granted Nov 3, 2015·2 cites·15 claims
- 1063US12272888B2Electronic device and antenna feeding moduleWISTRON NEWEB CORP·Filed 2021·Granted Apr 8, 2025·0 cites·8 claims
- 1159US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 1257US2025167456A1AntennaMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1354US10074892B2Communication device with metal-frame half-loop antenna elementACER INC·Filed 2017·Granted Sep 11, 2018·0 cites·16 claims
- 1452US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 1551US12212060B2Electronic device and antenna moduleWISTRON NEWEB CORP·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
- 1651US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 1751US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 1849US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 1934US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 2034US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 2131US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsuan-Jui Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →