Inventor · disambiguated record
Hsu Ming Cheng
Also filed as: CHENG HSU M · CHENG HSU-MING
9 granted patents·2 pending applications·128 citations·filing 2004–2020
88Inventor score
Top patents by PatentIndex Score
11 records- 0193US7598523B2Test structures for stacking dies having through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Oct 6, 2009·52 cites·19 claims
- 0289US7759776B2Space transformer having multi-layer pad structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 20, 2010·21 cites·16 claims
- 0388US7733102B2Ultra-fine area array pitch probe cardTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·18 cites·20 claims
- 0483US8248091B2Universal array type probe card design for semiconductor device testingCHENG HSU MING·Filed 2006·Granted Aug 21, 2012·18 cites·20 claims
- 0581US7781235B2Chip-probing and bumping solutions for stacked dies having through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 24, 2010·10 cites·20 claims
- 0669US8940363B2Preparation of hollow polymer microspheresFUNG DEIN RUN·Filed 2012·Granted Jan 27, 2015·2 cites·3 claims
- 0757US2021087750A1Aqueous coating material for synthetic papers and synthetic paper using the sameNANYA PLASTICS CORP·Filed 2020·Application pending·0 cites
- 0854US7642793B2Ultra-fine pitch probe card structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·2 cites·20 claims
- 0953US7696766B2Ultra-fine pitch probe card structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 13, 2010·2 cites·28 claims
- 1046US7154285B2Method and apparatus for providing PCB layout for probe cardTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 26, 2006·3 cites·15 claims
- 1136US2006103398A1Systems and methods for etching and plating probe cardsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →