Inventor · disambiguated record
Hsiao-Pang Chou
Also filed as: CHOU HSIAO-PANG
22 granted patents·2 pending applications·282 citations·filing 1997–2021
95Inventor score
Top patents by PatentIndex Score
24 records- 0198US9209273B1Method of fabricating metal gate structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 8, 2015·59 cites·20 claims
- 0295US10269868B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 23, 2019·12 cites·12 claims
- 0394US10177311B1Resistive random access memory (RRAM) and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·11 cites·20 claims
- 0493US10283564B1Semiconductor structure and the method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 7, 2019·8 cites·18 claims
- 0592US9263540B1Metal gate structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·8 cites·5 claims
- 0681US9899491B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·3 cites·5 claims
- 0773US6221754B1Method of fabricating a plugUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 24, 2001·57 cites·15 claims
- 0871US6780761B1Via-first dual damascene processUNITED MICROELECTRONICS CORP·Filed 2003·Granted Aug 24, 2004·20 cites·21 claims
- 0967US11450747B2Semiconductor structure with an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 20, 2022·0 cites·9 claims
- 1067US6001414ADual damascene processing methodUNITED MICROELECTRONICS CORP·Filed 1997·Granted Dec 14, 1999·34 cites·20 claims
- 1166US9384985B2Semiconductor structure including silicon and oxygen-containing metal layer and process thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·1 cites·5 claims
- 1258US10636794B2Magnetic tunnel junction structure of magnetic random access memory cellUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·0 cites·10 claims
- 1357US11011376B2Method of manufacturing semiconductor structure with an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 1454US6500389B1Plasma arcing sensorUNITED MICROELECTRONICS CORP·Filed 2000·Granted Dec 31, 2002·2 cites·9 claims
- 1552US10312238B2Manufacturing method of magnetic random access memory cellUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·0 cites·10 claims
- 1651US10043882B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 7, 2018·0 cites·5 claims
- 1751US6080660AVia structure and method of manufactureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jun 27, 2000·16 cites·12 claims
- 1849US6214747B1Method for forming opening in a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 10, 2001·15 cites·19 claims
- 1947US6422246B1Method removing residual photoresistUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 23, 2002·1 cites·4 claims
- 2045US6376382B1Method for forming an openingUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 23, 2002·12 cites·18 claims
- 2145US6235644B1Method of improving etch back processUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 22, 2001·11 cites·24 claims
- 2240US2002062838A1Method of removing residual photoresistFiled 2002·Application pending·0 cites
- 2340US2006138925A1Plasma processing device having a ring-shaped air chamber for heat dissipationCHENG YI-FANG·Filed 2004·Application pending·0 cites
- 2436US5968846AMethod for removing silicon nitride materialUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 19, 1999·12 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →