Inventor · disambiguated record
Hsien-Ping Feng
Also filed as: FENG HSIEN-PING
12 granted patents·4 pending applications·88 citations·filing 2003–2011
89Inventor score
Top patents by PatentIndex Score
16 records- 0187US7432192B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Oct 7, 2008·11 cites·20 claims
- 0283US8580100B2Metal deposition using seed layersFENG HSIEN-PING·Filed 2011·Granted Nov 12, 2013·5 cites·15 claims
- 0383US7189650B2Method and apparatus for copper film quality enhancement with two-step depositionTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 13, 2007·28 cites·28 claims
- 0481US7030016B2Post ECP multi-step anneal/H2 treatment to reduce film impurityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 18, 2006·22 cites·37 claims
- 0564US7026233B2Method for reducing defects in post passivation interconnect processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·12 cites·25 claims
- 0660US7256120B2Method to eliminate plating copper defectTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 14, 2007·8 cites·17 claims
- 0748US6985222B2Chamber leakage detection by measurement of reflectivity of oxidized thin filmTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 10, 2006·0 cites·32 claims
- 0845US7667835B2Apparatus and method for preventing copper peeling in ECPTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 23, 2010·0 cites·15 claims
- 0945US2008067076A1Method of reducing oxygen content in ECP solutionTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1045US2006196765A1Metallization target optimization method providing enhanced metallization layer uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1144US7528478B2Semiconductor devices having post passivation interconnections and a buffer layerTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 5, 2009·0 cites·20 claims
- 1243US7262067B2Method for conductive film quality evaluationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 28, 2007·1 cites·23 claims
- 1342US7481910B2Method and apparatus for stabilizing plating film impuritiesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 27, 2009·1 cites·8 claims
- 1440US2006219566A1Method for fabricating metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1539US2007006405A1Systems and methods for wafer cleaningTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1637US7122471B2Method for preventing voids in metal interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →