Inventor · disambiguated record
Hsiang-An Feng
Also filed as: FENG HSIANG-AN
15 granted patents·9 pending applications·121 citations·filing 2008–2024
89Inventor score
Top patents by PatentIndex Score
24 records- 0191US8307432B1Generic shellcode detectionFENG HSIANG-AN·Filed 2008·Granted Nov 6, 2012·53 cites·26 claims
- 0290US8763125B1Disabling execution of malware having a self-defense mechanismFENG HSIANG-AN·Filed 2008·Granted Jun 24, 2014·41 cites·16 claims
- 0387US9361458B1Locality-sensitive hash-based detection of malicious codesTREND MICRO INC·Filed 2014·Granted Jun 7, 2016·24 cites·13 claims
- 0486US10944024B1Method for manufacturing micro light-emitting diode chipsUNIV NATIONAL CHIAO TUNG·Filed 2020·Granted Mar 9, 2021·2 cites·23 claims
- 0581US11508872B2Alignment module for transferring a magnetic light-emitting die and alignment method thereofINGENTEC CORP·Filed 2021·Granted Nov 22, 2022·1 cites·20 claims
- 0672US11791439B2Magnetic light-emitting structureINGENTEC CORP·Filed 2023·Granted Oct 17, 2023·0 cites·5 claims
- 0766US12487188B2Wafer defect analyzing device and wafer defect analyzing methodINGENTEC CORP·Filed 2024·Granted Dec 2, 2025·0 cites·15 claims
- 0863US2024178631A1Laser diode and laser diode manufacturing methodINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0961US11621368B2Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting elementINGENTEC CORP·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 1061US2025267982A1Vertical light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1161US2025287727A1Light emitting diode chip and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1257US2025331344A1Light emitting diode pixel package and manufacturing method for light emitting diode pixel packageINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1356US12417964B2Via-filling method of through-glass via substrateINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 1455US2025233028A1Micro-led wafer testing device and micro-led wafer testing methodINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1554US12418011B2Bonding and transferring method for die package structuresINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 1653US10622509B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2017·Granted Apr 14, 2020·0 cites·5 claims
- 1752US10622510B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2018·Granted Apr 14, 2020·0 cites·6 claims
- 1851US2024339579A1Light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2023·Application pending·0 cites
- 1950US12489093B2Magnetic LED die transferring device and magnetic LED die transferring methodINGENTEC CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 2050US2023170434A1Vertical light-emitting diode and method for fabricating the sameINGENTEC CORP·Filed 2022·Application pending·0 cites
- 2149US2024304749A1Encapsulation process method for wafer-level light-emitting diode diesINGENTEC CORP·Filed 2023·Application pending·0 cites
- 2247US11769861B2Light-emitting diode packaging structure and method for fabricating the sameINGENTEC CORP·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 2344US9079250B2Method of preparing silver nanowireNICHING IND CORP·Filed 2013·Granted Jul 14, 2015·0 cites·11 claims
- 2438US2020058523A1Gas etching deviceINGENTEC CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →