Inventor · disambiguated record
Hsing-Chou Hsu
Also filed as: HSU HSING-CHOU
9 granted patents·3 pending applications·24 citations·filing 2005–2012
81Inventor score
Top patents by PatentIndex Score
12 records- 0179US7291916B2Signal transmission structure and circuit substrate thereofVIA TECH INC·Filed 2005·Granted Nov 6, 2007·9 cites·20 claims
- 0274US7615708B2Arrangement of non-signal through vias and wiring board applying the sameVIA TECH INC·Filed 2006·Granted Nov 10, 2009·9 cites·20 claims
- 0365US8120441B2Circuit board with a reference plane having multi-part non-conductive regions for decreased crosstalkHSU HSING-CHOU·Filed 2009·Granted Feb 21, 2012·3 cites·6 claims
- 0456US7279913B2Testing assembly for electrical test of electronic package and testing socket thereofVIA TECH INC·Filed 2005·Granted Oct 9, 2007·3 cites·11 claims
- 0547US8332804B2Impedance design methodHSU HSING-CHOU·Filed 2012·Granted Dec 11, 2012·0 cites·3 claims
- 0644US8151241B2Impedance design methodHSU HSING-CHOU·Filed 2010·Granted Apr 3, 2012·0 cites·4 claims
- 0741US7449788B2Chip structure with arrangement of side padsVIA TECH INC·Filed 2006·Granted Nov 11, 2008·0 cites·13 claims
- 0839US8204731B2Signal analyzing method for electronic device having on-chip network and off-chip networkHSU HSING-CHOU·Filed 2010·Granted Jun 19, 2012·0 cites·2 claims
- 0938US2007194434A1Differential signal transmission structure, wiring board, and chip packageLIN CHIN-SUNG·Filed 2006·Application pending·0 cites
- 1036US7586320B2Plunger and chip-testing module applying the sameVIA TECH INC·Filed 2006·Granted Sep 8, 2009·0 cites·7 claims
- 1132US2012176150A1Measuring equipment for probe-effect cancellation and method thereofHSU HSING-CHOU·Filed 2011·Application pending·0 cites
- 1232US2007102794A1Lead arrangement and chip package using the sameHSIAO CHAO-YANG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →