Inventor · disambiguated record
Hsi-Cheng Hsu
Also filed as: HSU HSI-CHENG
33 granted patents·6 pending applications·60 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
39 records- 0196US11789360B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 0296US11543363B2Systems and methods for wafer bond monitoringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·5 cites·20 claims
- 0394US11782284B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
- 0492US11726342B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0592US11392024B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0691US9527721B2Movement microelectromechanical systems (MEMS) packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·14 cites·20 claims
- 0790US10155656B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·5 cites·20 claims
- 0889US11454820B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·5 cites·20 claims
- 0989US11407636B2Inter-poly connection for parasitic capacitor and die size improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·4 cites·20 claims
- 1085US12242181B2Photomask assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1185US11448891B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·3 cites·20 claims
- 1285US2025353736A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1384US2024361609A1Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1482US12092839B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1582US12054382B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1682US10513432B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1782US10131536B2Heater design for MEMS chamber pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·2 cites·20 claims
- 1881US12271006B2Multifunctional collimator for contact image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1981US9884758B2Selective nitride outgassing process for MEMS cavity pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 2081US9880192B2Method of manufacturing a motion sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·4 cites·20 claims
- 2179US2024385124A1Systems and methods for wafer bond monitoringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2278US12157667B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2378US11305980B2Anti-stiction process for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·7 claims
- 2477US12454455B2Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2576US11815471B2Systems and methods for wafer bond monitoringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 2675US12283568B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 2774US11655138B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2873US12466727B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 2973US2025246578A1Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3070US8960003B2Motion sensor device and methods for forming the sameCHENG SHYH-WEI·Filed 2012·Granted Feb 24, 2015·4 cites·12 claims
- 3168US9090452B2Mechanism for forming MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·2 cites·20 claims
- 3266US12085518B2Systems and methods for wafer bond monitoringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 3366US11742320B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·14 claims
- 3464US11655146B2Extended acid etch for oxide removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 3562US10532925B2Heater design for MEMS chamber pressure controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 3660US2025372551A1Semiconductor structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3759US2025226342A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3858US9561954B2Method of fabricating MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·20 claims
- 3954US8916943B2MEMS devices having a plurality of cavitiesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Hsi-Cheng Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →