Inventor · disambiguated record
Hsin-Fu Huang
Also filed as: HUANG HSIN-FU
50 granted patents·16 pending applications·303 citations·filing 1998–2025
98Inventor score
Files withUNITED MICROELECTRONICS CORP40HUANG HSIN-FU7LIN KUN-HSIEN3HSU CHI-MAO2TA FENG ELECTRICAL APPLIANCES CO LTD2
Top patents by PatentIndex Score
66 records- 0196US10043811B1Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·14 cites·7 claims
- 0295US11968906B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 23, 2024·5 cites·8 claims
- 0394USD404606SBlenderTA FENG ELECTRICAL APPLIANCES CO LTD·Filed 1998·Granted Jan 26, 1999·56 cites·1 claims
- 0493US9679813B2Semiconductor structure and process for forming plug including layer with pulled back sidewall partUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 13, 2017·9 cites·8 claims
- 0592US8836049B2Semiconductor structure and process thereofTSAI MIN-CHUAN·Filed 2012·Granted Sep 16, 2014·29 cites·12 claims
- 0691USD498642SFruit juicerFiled 2003·Granted Nov 23, 2004·44 cites·1 claims
- 0790US10199269B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·6 cites·10 claims
- 0890US9166020B2Metal gate structure and manufacturing method thereofYANG CHAN-LON·Filed 2011·Granted Oct 20, 2015·11 cites·8 claims
- 0989US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 1088USD404607SBlenderTA FENG ELECTRICAL APPLIANCES CO LTD·Filed 1998·Granted Jan 26, 1999·36 cites·1 claims
- 1188US2025344612A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1287US9018086B2Semiconductor device having a metal gate and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·7 cites·5 claims
- 1385US8735269B1Method for forming semiconductor structure having TiN layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 27, 2014·7 cites·14 claims
- 1485US8662692B2Touch panel using assembling frame for assemblyHUANG HSIN-FU·Filed 2011·Granted Mar 4, 2014·5 cites·14 claims
- 1584US12389807B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Aug 12, 2025·0 cites·9 claims
- 1684US12279536B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 15, 2025·0 cites·6 claims
- 1780USD499303SCutting device for fruit juicerFiled 2003·Granted Dec 7, 2004·24 cites·1 claims
- 1879US9006092B2Semiconductor structure having fluoride metal layer and process thereofLIN KUN-HSIEN·Filed 2011·Granted Apr 14, 2015·4 cites·17 claims
- 1979US2025212696A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2077US9755047B2Semiconductor process and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·2 cites·3 claims
- 2177US8802524B2Method of manufacturing semiconductor device having metal gatesLIAO PO-JUI·Filed 2011·Granted Aug 12, 2014·5 cites·20 claims
- 2277US8691681B2Semiconductor device having a metal gate and fabricating method thereofHSU CHI-MAO·Filed 2012·Granted Apr 8, 2014·4 cites·13 claims
- 2374US8860135B2Semiconductor structure having aluminum layer with high reflectivityHSU CHI-MAO·Filed 2012·Granted Oct 14, 2014·3 cites·5 claims
- 2474US8420544B2Method for fabricating interconnection structure with dry-cleaning processHUANG HSIN-FU·Filed 2010·Granted Apr 16, 2013·3 cites·16 claims
- 2570US12237395B2High electron mobility transistor and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 2668US11239243B2Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 1, 2022·0 cites·3 claims
- 2767USD416168SBlenderTA FENG ELECTRICAL APPLIANCE CO·Filed 1998·Granted Nov 9, 1999·15 cites·1 claims
- 2866US11424408B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·7 claims
- 2965US2025159916A1High electron mobility transistor and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 3064US9570348B2Method of forming contact strucutreUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·1 cites·11 claims
- 3163US11877433B2Storage node contact structure of a memory deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 16, 2024·0 cites·5 claims
- 3262US9312121B1Method for cleaning contact hole and forming contact plug thereinUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·9 claims
- 3361US12211888B2Method for forming a thin film resistor with improved thermal stabilityUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 3460US10685964B2Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 16, 2020·0 cites·6 claims
- 3558US10497617B2Conductive structure and method for manufacturing conductive structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 3, 2019·0 cites·9 claims
- 3657US11165019B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 3756US10756090B2Storage node contact structure of a memory device and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·3 claims
- 3855US10199228B2Manufacturing method of metal gate structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 5, 2019·0 cites·8 claims
- 3955US10068797B2Semiconductor process for forming plugUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·0 cites·12 claims
- 4055US9087782B2Manufacturing process of gate stack structure with etch stop layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 21, 2015·0 cites·7 claims
- 4154US9558996B2Method for filling trench with metal layer and semiconductor structure formed by using the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jan 31, 2017·0 cites·9 claims
- 4254US9190292B2Manufacturing process of gate stack structure with etch stop layerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 17, 2015·0 cites·5 claims
- 4354US9130032B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Sep 8, 2015·0 cites·20 claims
- 4454US9076784B2Transistor and semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 7, 2015·0 cites·5 claims
- 4553US9985110B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·0 cites·9 claims
- 4652US9653300B2Structure of metal gate structure and manufacturing method of the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 16, 2017·0 cites·7 claims
- 4750US8530980B2Gate stack structure with etch stop layer and manufacturing process thereofLIN KUN-HSIEN·Filed 2011·Granted Sep 10, 2013·0 cites·9 claims
- 4849USD428301SChopperHUANG HSIN-FU·Filed 1999·Granted Jul 18, 2000·6 cites·1 claims
- 4948US2015380512A1Metal gate structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 5047US8841733B2Semiconductor device and method of fabricating the sameHUANG HSIN-FU·Filed 2011·Granted Sep 23, 2014·0 cites·4 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →