Inventor · disambiguated record
Hsiang-Hung Huang
Also filed as: HUANG HSIANG · HUANG HSIANG-HUNG
3 granted patents·4 pending applications·8 citations·filing 2016–2025
57Inventor score
Top patents by PatentIndex Score
7 records- 0181US9883579B1Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 30, 2018·7 cites·20 claims
- 0275US2025366104A1Complementary field effect transistor with conductive through substrate layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0362US2024072115A1Complementary field effect transistor with conductive through substrate layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0452US2024186323A1Integrated circuit and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0551US10117995B2Needle structureHUANG HSIANG·Filed 2016·Granted Nov 6, 2018·1 cites·5 claims
- 0649US2024072136A1Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0744US10470317B2Method for manufacturing circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 5, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →