Inventor · disambiguated record
Hsiang-Wen Ke
Also filed as: KE HSIANG-WEN
9 granted patents·7 pending applications·6 citations·filing 2019–2025
79Inventor score
Files withUNITED MICROELECTRONICS CORP16
Top patents by PatentIndex Score
16 records- 0195US11968906B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 23, 2024·5 cites·8 claims
- 0288US2025344612A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0384US12389807B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Aug 12, 2025·0 cites·9 claims
- 0484US12279536B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 15, 2025·0 cites·6 claims
- 0579US2025212696A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0673US2024397832A1Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0773US2025081568A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0868US12089504B2Magnetic random access memory device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
- 0966US12183801B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 31, 2024·0 cites·7 claims
- 1066US10867808B1Manufacturing method of connection structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 15, 2020·1 cites·19 claims
- 1160US12336245B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·12 claims
- 1258US2025089448A1Organic light-emitting diode display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1357US2025248103A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1456US12426515B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 23, 2025·0 cites·11 claims
- 1545US11450564B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 20, 2022·0 cites·7 claims
- 1645US2022122915A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →