Inventor · disambiguated record
Hsiangyu Lee
Also filed as: LEE HSIANGYU
0 granted patents·3 pending applications·0 citations·filing 2023–2023
Files withAPPLIED MATERIALS INC3
Top patents by PatentIndex Score
3 records- 0154US2024188300A13d memory including hollow epitaxial channelsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0254US2024185893A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0351US2024186178A1Wordline contact formation for nand deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →