Inventor · disambiguated record
Hsin-Yu Li
Also filed as: LI HSIN-YU · LI HSIN-YU S · LI HSIN-YU SIDNEY
8 granted patents·8 pending applications·104 citations·filing 1993–2025
84Inventor score
Top patents by PatentIndex Score
16 records- 0191US8469261B2System and method for product identificationBONNER BRETT BRACEWELL·Filed 2011·Granted Jun 25, 2013·35 cites·12 claims
- 0291US5438439ANon-destructive readout mechanism for volume holograms using two wavelengthsFiled 1993·Granted Aug 1, 1995·64 cites·8 claims
- 0388US2025329604A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2025·Application pending·0 cites
- 0484US12417958B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zoneINTEL CORP·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 0583US12347743B2Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 0681US2024014097A1Microelectronics package comprising a package-on-package (pop) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zoneINTEL CORP·Filed 2023·Application pending·0 cites
- 0768US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 0866US9122677B2System and method for product identificationSUNRISE R & D HOLDINGS LLC·Filed 2013·Granted Sep 1, 2015·3 cites·12 claims
- 0965US12315777B2Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zoneINTEL CORP·Filed 2019·Granted May 27, 2025·0 cites·23 claims
- 1054US11935861B2Underfill flow management in electronic assembliesINTEL CORP·Filed 2020·Granted Mar 19, 2024·0 cites·16 claims
- 1146US2023317668A1Barriers to modulate underfill flowLIN ZIYIN·Filed 2022·Application pending·0 cites
- 1245US2016343591A1Reduction of underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1336US2020006169A1Micro-electronic package with barrier structureINTEL CORP·Filed 2018·Application pending·0 cites
- 1434US2024339019A1System, electrical socket device and method for monitoring usage of an electrical applianceUEC SYSTEM SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1531US2017270436A1Reservation and notification system and method using mobile communication deviceFANG PEI-LING·Filed 2016·Application pending·0 cites
- 1629US2003157414A1Holographic medium and process for use thereofFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →