Inventor · disambiguated record
Hsiu-Han Liao
Also filed as: LIAO HSIU-HAN
30 granted patents·4 pending applications·88 citations·filing 1997–2024
94Inventor score
Files withWINBOND ELECTRONICS CORP25CHIANG LU-PING3LIAO HSIU-HAN2TAIWAN SEMICONDUCTOR MFG2WINBOND ELECTROICS CORP1
Top patents by PatentIndex Score
34 records- 0193US7906396B1Flash memory and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2009·Granted Mar 15, 2011·35 cites·14 claims
- 0284US11678484B2Semiconductor structure and manufacturing method thereof and flash memoryWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·12 claims
- 0382US8133777B1Method of fabricating memoryCHIANG LU-PING·Filed 2011·Granted Mar 13, 2012·8 cites·8 claims
- 0472US12471277B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2024·Granted Nov 11, 2025·0 cites·12 claims
- 0570US11877447B2Manufacturing method of semiconductor structure and flash memoryWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 0669US5913122AMethod of making high breakdown voltage twin well device with source/drain regions widely spaced from FOX regionsTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jun 15, 1999·27 cites·20 claims
- 0768US10615087B2Semiconductor wafer with test key structureWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 7, 2020·1 cites·17 claims
- 0865US11805644B2Manufacturing method of memory deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·17 claims
- 0963US9812641B2Non-volatile memory device and methods for fabricating the sameWINDBOND ELECTRONICS CORP·Filed 2014·Granted Nov 7, 2017·1 cites·10 claims
- 1061US11974428B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·9 claims
- 1160US12438004B2Method for forming semiconductor device that includes flash memoryWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1260US2025287585A1Manufacturing method of semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1357US8124488B2Method of fabricating memoryCHIANG LU-PING·Filed 2010·Granted Feb 28, 2012·1 cites·14 claims
- 1456US11839076B2Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 1556US11257833B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·0 cites·6 claims
- 1656US7560338B2Manufacturing method of non-volatile memoryWINBOND ELECTRONICS CORP·Filed 2007·Granted Jul 14, 2009·1 cites·10 claims
- 1755US10147730B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 4, 2018·0 cites·10 claims
- 1853US9972631B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·6 claims
- 1953US8440526B2Method of fabricating memoryLIAO HSIU-HAN·Filed 2011·Granted May 14, 2013·1 cites·10 claims
- 2053US2024387748A1Semiconductor structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2152US11823738B2Resistive memory apparatusWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 21, 2023·0 cites·14 claims
- 2252US11638378B2Method of fabricating semicondoctor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 25, 2023·0 cites·14 claims
- 2352US9356235B2Structure and formation method of memory deviceWINBOND ELECTRONICS CORP·Filed 2014·Granted May 31, 2016·0 cites·14 claims
- 2452US9166160B1Resistive random access memory and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·10 claims
- 2551US2025191672A1Flash memory and testing method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2649US11251273B2Non-volatile memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 15, 2022·0 cites·12 claims
- 2748US6025628AHigh breakdown voltage twin well device with source/drain regions widely spaced from fox regionsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 15, 2000·10 cites·14 claims
- 2846US10971508B2Integrated circuit and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 2945US11362098B2Method for manufacturing memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 3045US11257922B2Self-aligned contact and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·0 cites·13 claims
- 3144US8084320B2Non-volatile memory and method for fabricating the sameCHIANG LU-PING·Filed 2009·Granted Dec 27, 2011·0 cites·9 claims
- 3243US7656704B2Multi-level operation in nitride storage memory cellWINBOND ELECTRONICS CORP·Filed 2006·Granted Feb 2, 2010·2 cites·6 claims
- 3335US2006214216A1Non-volatile memory and method of manufacturing the sameLIAO HSIU-HAN·Filed 2005·Application pending·0 cites
- 3434US10699975B2Semiconductor deviceWINBOND ELECTROICS CORP·Filed 2018·Granted Jun 30, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →