Inventor · disambiguated record
Hsin-Jung Liu
Also filed as: LIU HSIN-JUNG
10 granted patents·8 pending applications·8 citations·filing 2005–2024
81Inventor score
Top patents by PatentIndex Score
18 records- 0183US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0280US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 0379US9966263B1Method of fabricating fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·3 cites·16 claims
- 0477US10804461B1Manufacturing method of memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 13, 2020·3 cites·12 claims
- 0576US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 0670US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
- 0766US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 0866US2024170299A1Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0964US12494456B2Semiconductor assembly and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 1061US2025351731A1Method for planarizing surface of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1158US11923205B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 1257US2025343050A1Method for planarizing surface of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1353US2025169368A1Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1450US11482666B2Method for fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1548US2024071988A1Method for manufacturing semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1645US11145602B2Alignment mark structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·0 cites·13 claims
- 1736US2020185597A1Memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1835US2006211554A1Tool magazine assembly for a machining centerLIU HSIN-JUNG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →